参数资料
型号: MAX9775EBX+TG45
厂商: Maxim Integrated Products
文件页数: 17/38页
文件大小: 0K
描述: IC AMP AUDIO PWR 1.5W STER 36WLP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
系列: DirectDrive®
类型: D 类
输出类型: 2-通道(立体声)带立体声耳机
在某负载时最大输出功率 x 通道数量: 1.5W x 2 @ 4 欧姆; 60mW x 2 @ 16 欧姆
电源电压: 2.7 V ~ 5.5 V
特点: 3D,消除爆音,差分输入,I²C,静音,短路和热保护,关机,音量控制
安装类型: 表面贴装
供应商设备封装: 36-WLP
封装/外壳: 36-UFBGA,WLCSP
包装: 带卷 (TR)
MAX9775/MAX9776
if the right and left volume controls are set for a maxi-
mum gain 0dB (11111 in Table 7, IN+6dB = 0 from Table
10) before the 3D effect is activated, the volume control
should be programmed to -6dB (11001 in Table 7)
immediately after the 3D effect has been activated.
Signal Path
The audio inputs of the MAX9775/MAX9776—INA, INB,
and INC—are preamplified and then mixed by the input
mixer to create three internal signals: Left (L), Right (R),
and Mono (M). Tables 5a and 5b show how the inputs
are mixed to create L, R, and M. These signals are then
independently volume adjusted by the L, R, and M vol-
ume control and routed to the output mixer. The output
mixer mixes the internal L, R, and M signals to create a
variety of audio mixes that are output to the headphone
speaker and mono receiver amplifiers. Figure 6 shows
the signal path that the audio signals take.
Signal amplification takes place in three stages. In the
first stage, the inputs (INA, INB, and INC) are pre-
amplified. The amount by which each input is amplified
is determined by the bits INA+20dB (B4 in the Input
Mode Control Register) and IN+6dB (B3 in the Global
Control Register). After preamplification, they are mixed
in the Input Mixer to create the internal signals L, R,
and M.
In the second stage of amplification, the internal L, R,
and M signals are independently volume adjusted.
Finally, each output amplifier has its own internal gain.
The speaker, headphone, and mono receiver amplifiers
have fixed gains of 12dB, 3dB, and 3dB, respectively.
Current-Limit and Thermal Protection
The MAX9775/MAX9776 feature current limiting and
thermal protection to protect the device from short cir-
cuits and overcurrent conditions. The headphone
amplifier pulses in the event of an overcurrent condition
with a pulse every 100s as long as the condition is
present. Should the current still be high, the above
cycle is repeated. The speaker amplifier current-limit
protection clamps the output current without shutting
down the output. This can result in a distorted output.
Current is limited to 1.6A in the speaker amplifiers and
170mA in the headphone and mono receiver amplifiers.
The MAX9775/MAX9776 have thermal protection that
disables the device at +150°C until the temperature
decreases to +120°C.
2 x 1.5W, Stereo Class D Audio Subsystem
with DirectDrive Headphone Amplifier
24
______________________________________________________________________________________
INPUT
MIXER
INPUT
PREAMPLIFIER
INPUT A:
0dB, 6dB, 20dB
-75dB TO 0dB
0dB TO 6dB
MVOL
MONO+6dB
LVOL
-75dB TO 0dB
RVOL
INPUT B AND C:
0dB, 6dB
OUTPUT
MIXER
3dB
12dB
SPEAKER
HEADPHONE
RECEIVER
MONO
Figure 7. Signal Path
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MAX9776EBX+TG45 功能描述:音频放大器 2 x 1.5W Stereo Class D Subsystem RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
MAX9776ETJ+ 功能描述:音频放大器 2 x 1.5W Stereo Class D Subsystem RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
MAX9776ETJ+T 功能描述:音频放大器 2 x 1.5W Stereo Class D Subsystem RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
MAX9776EVKIT+ 功能描述:音频 IC 开发工具 MAX9776 Eval Kit RoHS:否 制造商:Texas Instruments 产品:Evaluation Kits 类型:Audio Amplifiers 工具用于评估:TAS5614L 工作电源电压:12 V to 38 V
MAX9777ETI+ 功能描述:音频放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel