参数资料
型号: MAX9776ETJ+T
厂商: Maxim Integrated Products
文件页数: 8/38页
文件大小: 0K
描述: IC AMP AUDIO PWR 1.5W D 32TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
系列: DirectDrive®
类型: D 类
输出类型: 1-通道(单声道),带立体声耳机
在某负载时最大输出功率 x 通道数量: 1.5W x 1 @ 4 欧姆; 60mW x 2 @ 16 欧姆
电源电压: 2.7 V ~ 5.5 V
特点: 消除爆音,差分输入,I²C,静音,短路和热保护,关机,音量控制
安装类型: 表面贴装
供应商设备封装: 32-TQFN-EP(5x5)
封装/外壳: 32-WFQFN 裸露焊盘
包装: 带卷 (TR)
配用: MAX9776EVKIT+-ND - EVALUATION KIT FOR MAX9776
MAX9775/MAX9776
2 x 1.5W, Stereo Class D Audio Subsystem
with DirectDrive Headphone Amplifier
16
______________________________________________________________________________________
Pin Description—MAX9776
PIN
TQFN
UCSP
NAME
FUNCTION
1F1
PVDD
Class D Power Supply
2
E1
OUT-
Negative Left-Speaker Output
3
D2
SCL
Serial Clock Input. Connect a 1k
Ω pullup resistor from SCL to VDD.
4, 29
D1, F3
PGND
Power Ground
5
C1
OUT+
Positive Left-Speaker Output
6
C2
SDA
Serial Data Input. Connect a 1k
Ω pullup resistor from SDA to VDD.
7, 8, 23,
26, 28, 31
B1, B2,
E6, F2,
F4, F5
I.C.
Internal Connection. Leave unconnected. This pin is internally connected to the signal path.
Do not connect together or to any other pin.
9
A1
CPVDD
Charge-Pump Power Supply
10
A2
C1P
Charge-Pump Flying Capacitor Positive Terminal
11
B3
VBIAS
Common-Mode Bias
12
A3
CPGND
Charge-Pump GND
13
A4
C1N
Charge-Pump Flying Capacitor Negative Terminal
14
B4
INC1
Input C1. Left input or positive input (see Table 5a).
15
A5
CPVSS
Charge-Pump Output. Connect to VSS.
16
A6
HPL
Left Headphone Output
17
B5
VSS
Headphone Amplifier Negative Power Supply. Connect to CPVSS.
18
B6
HPR
Right Headphone Output
19
C5
INC2
Input C2. Right input or negative input (see Table 5a).
20
C6
OUTRx
Mono Receiver Output
21
D6
VDD
Analog Power Supply
22
D5
INB2
Input B2. Right input or negative input (see Table 5a).
24
E5
INB1
Input B1. Left input or positive input (see Table 5a).
25
F6
GND
Analog Ground
27
E4
INA2
Input A2. Right input or negative input (see Table 5a).
30
E3
INA1
Input A1. Left input or positive input (see Table 5a).
32
E2
SHDN
Active-Low Hardware Shutdown
EP
EP
Exposed Pad. The external pad lowers the package’s thermal impedance by providing a
direct heat conduction path from the die to the PCB. The exposed pad is internally connected
to GND. Connect the exposed thermal pad to the GND plane.
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MAX9778ETI+T 功能描述:音频放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel