参数资料
型号: MAX9860ETG+
厂商: Maxim Integrated Products
文件页数: 12/38页
文件大小: 0K
描述: IC CODEC MONO AUD 16BIT 24TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 75
类型: 音频编解码器
数据接口: 串行
分辨率(位): 16 b
ADC / DAC 数量: 1 / 2
三角积分调变:
动态范围,标准 ADC / DAC (db): 81 / 90
电压 - 电源,模拟: 1.7 V ~ 1.9 V
电压 - 电源,数字: 1.7 V ~ 1.9 V
工作温度: -40°C ~ 85°C
封装/外壳: 24-WFQFN 裸露焊盘
供应商设备封装: 24-TQFN-EP(4x4)
包装: 托盘
MAX9860
16-Bit Mono Audio Voice Codec
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = VDVDD = VDVDDIO = +1.8V, RL =
∞, headphone load (RL) connected between OUTP and OUTN, CREF = 2.2F, CMICBIAS =
CPREG = CREG = 1F, AVPRE = +20dB, AVMICPGA = 0dB, fMCLK = 13MHz, fLRCLK = 8kHz, TA = TMIN to TMAX, unless otherwise noted.
Typical values are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to AGND.)
DVDDIO, SDA, SCL, IRQ.......................................-0.3V to +3.6V
AVDD, DVDD............................................................-0.3V to +2V
AGND, DGND, MICGND .......................................-0.3V to +0.3V
OUTP, OUTN, PREG, REF, MICBIAS .....-0.3V to (VAVDD + 0.3V)
MICLP, MICLN, MICRP, MICRN, REG....-0.3V to (VPREG + 0.3V)
MCLK, LRCLK, BCLK,
SDOUT, SDIN..................................-0.3V to (VDVDDIO + 0.3V)
Continuous Power Dissipation (TA = +70°C)
24-Pin TQFN (derate 27.8mW/°C above +70°C,
multilayer board) ......................................................2222mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
AVDD (inferred from HP output PSRR)
1.7
1.8
1.9
DVDD (inferred from codec performance
tests)
1.7
1.8
1.9
Supply Voltage Range
DVDDIO
1.7
1.8
3.6
V
AVDD
1.46
2.2
DAC playback mode
(48kHz)
DVDD
1.05
1.6
AVDD
4.08
5.7
Full operation
8kHz mono ADC + DAC
DVDD
0.78
1.0
AVDD
6.17
9.0
Full operation
8kHz stereo ADC + DAC
DVDD
0.8
1.2
AVDD
5.38
8.0
Total Supply Current
(Note 3)
IAVDD+DVDD
Stereo ADC only (48kHz)
DVDD
1.68
2.2
mA
AVDD
0.56
5
Shutdown Supply Current
ISHDN
TA = +25°C
DVDD +
DVDDIO
1.65
5
A
Shutdown to Full Operation
10
ms
DAC (Note 4)
Gain Error
±1
±5
%
Dynamic Range (Note 5)
DR
+0dB volume setting, fS = 8kHz, measured
at headphone output, TA = +25°C
84
90
dB
DAC Full-Scale Output
1VRMS
fS = 8kHz
1.2
DAC Path Phase Delay
f = 1kHz, 0dBFS, HP
filter disabled, digital
input to analog output
fS = 16kHz
0.59
ms
Total Harmonic Distortion + Noise
THD+N
f = 1kHz, fMCLK = 12.288MHz,
fLRCLK = 48kHz
-87
dB
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (
θJA)...............36°C/W
Junction-to-Case Thermal Resistance (
θJC)......................3°C/W
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