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| 型号： | MAX9879ERV+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 21/32页 |
| 文件大小： | 0K |
| 描述： | IC AUDIO SUBSYSTEM 30-UCSP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 系列： | DirectDrive® |
| 类型： | D 类 |
| 输出类型： | 2-通道（立体声）带立体声耳机 |
| 在某负载时最大输出功率 x 通道数量： | 715mW x 2 @ 8 欧姆; 58mW x 2 @ 16 欧姆 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 特点： | 消除爆音，差分输入，I²C，静音，短路和热保护，关机，音量控制 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 30-UCSP（5x6） |
| 封装/外壳： | 30-WFBGA，CSPBGA |
| 包装： | 带卷 (TR) |
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MAX9879
Stereo Class D Audio Subsystem
with DirectDrive Headphone Amplifier
28
Maxim Integrated
actual speaker lead length. Select a capacitor less than
1nF based on EMI performance.
Input Capacitor
An input capacitor, CIN, in conjunction with the input
impedance of the MAX9879 forms a highpass filter that
removes the DC bias from an incoming signal. The AC-
coupling capacitor allows the amplifier to automatically
bias the signal to an optimum DC level. Assuming zero
source impedance, the -3dB point of the highpass filter
is given by:
Choose CIN so that f-3dB is well below the lowest fre-
quency of interest. Use capacitors whose dielectrics
have low-voltage coefficients, such as tantalum or alu-
minum electrolytic. Capacitors with high-voltage coeffi-
cients, such as ceramics, may result in increased
distortion at low frequencies.
BIAS Capacitor
BIAS is the output of the internally generated DC bias volt-
age. The BIAS bypass capacitor, CBIAS, reduces power
supply and other noise sources at the common-mode
bias node. Bypass BIAS with a 1F capacitor to GND.
Charge-Pump Capacitor Selection
Use capacitors with an ESR less than 100m
Ω for optimum
performance. Low-ESR ceramic capacitors minimize the
output resistance of the charge pump. Most surface-
mount ceramic capacitors satisfy the ESR requirement.
For best performance over the extended temperature
range, select capacitors with an X7R dielectric.
Flying Capacitor (C1)
The value of the flying capacitor (C1) affects the output
resistance of the charge pump. A C1 value that is too
small degrades the device’s ability to provide sufficient
current drive, which leads to a loss of output voltage.
Increasing the value of C1 reduces the charge-pump out-
put resistance to an extent. Above 1F, the on-resistance
of the switches and the ESR of C1 and C2 dominate.
Output Holding Capacitor (C2)
The output capacitor value and ESR directly affect the
ripple at VSS. Increasing the value of C2 reduces output
ripple. Likewise, decreasing the ESR of C2 reduces both
ripple and output resistance. Lower capacitance values
can be used in systems with low maximum output power
levels. See the
Output Power vs. Load Resistance graph
in the
Typical Operating Characteristics.
PVDD Bulk Capacitor (C3)
In addition to the recommended PVDD bypass capaci-
tance, bulk capacitance equal to C3 should be used.
Place the bulk capacitor as close as possible to the device.
Supply Bypassing,
Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. Use wide traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Wide traces also aid in mov-
ing heat away from the package. Proper grounding
improves audio performance, minimizes crosstalk
between channels, and prevents any switching noise
from coupling into the audio signal. Connect PGND and
GND together at a single point on the PCB. Route all
traces that carry switching transients away from GND
and the traces/components in the audio signal path.
Connect the PVDD_ pins to a 2.7V to 5.5V source.
Bypass PVDD_ to PGND pin with a 1F ceramic capac-
itor. Additional bulk capacitance should be used to pre-
vent power supply pumping. Bypass PVDD_ to the
PGND pin with a 1F ceramic capacitor. Additional
bulk capacitance should be used to prevent power-
supply pumping. Place the bypass capacitors as close
as possible to the MAX9879.
Connect VDD to PVDD_. Bypass VDD to GND with a
1F capacitor. Place the bypass capacitors as close as
possible to the MAX9879.
f
RC
dB
IN IN
=
3
1
2
π
RF SUSCEPTIBILITY
MAX9877
fig14
FREQUENCY (Hz)
EFFICIENCY
(dB
μ
)
10k
1k
100
-130
-110
-90
-70
-50
-30
-10
-150
10
100k
THRESHOLD OF HEARING
MAX9879
NOISE FLOOR
Figure 14. MAX9879 Susceptibility to a GSM Cell Phone Radio
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相关代理商/技术参数 |
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| MAX9879EVKIT+ | 功能描述:音频放大器 Stereo Class D Audio Subsystem with DirectDrive Headphone Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX987ESA | 功能描述:校验器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压（最大值）:6 mV 电源电流（最大值）:1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel |
| MAX987ESA+ | 功能描述:校验器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压（最大值）:6 mV 电源电流（最大值）:1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel |
| MAX987ESA+T | 功能描述:校验器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压（最大值）:6 mV 电源电流（最大值）:1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel |
| MAX987ESA-T | 功能描述:校验器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压（最大值）:6 mV 电源电流（最大值）:1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel |
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