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| 型号： | MAX9947ETE+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 2/17页 |
| 文件大小： | 0K |
| 描述： | TXRX AISG INTEGRATED 16TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 频率： | 2.176MHz |
| 数据传输率 - 最大： | 115.2kbps |
| 调制或协议： | OOK |
| 应用： | AISG |
| 功率 - 输出： | 12dBm |
| 电源电压： | 3 V ~ 5.5 V |
| 数据接口： | PCB，表面贴装 |
| 存储容量： | * |
| 天线连接器： | PCB，表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 16-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
AISG Integrated Transceiver
ABSOLUTE MAXIMUM RATINGS
V CC to GND.............................................................-0.3V to +6V
V L to GND ...............................................................-0.3V to +6V
TXOUT, BIAS to GND ............................... -0.3V to (V CC + 0.3V)
RXIN, XTAL1, XTAL2, SYNCOUT, RES to GND ......-0.3V to +6V
TXIN, RXOUT, DIR, DIRMD1,
DIRMD2 to GND ...................................... -0.3V to (V L + 0.3V)
Output Short-Circuit Current TXOUT,
SYNCOUT to V CC or GND ....................................Continuous
All Other Pins Max In/Out Current ................................... ±20mA
Continuous Power Dissipation (T A = +70°C)
16-Pin TQFN (derate 17.5mW/°C) .............................1399mW
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) ......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance ( q JA ) .......57.2°C/W
Junction-to-Case Thermal Resistance ( q JC ) ...............40°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V CC = 5V, V L = 3.3V, TXOUT connected with 50 I to RXIN, 4.1k I resistor between BIAS and RES, 10k I resistor between RES and
GND, 1k I resistor between SYNCOUT and V CC , T A = T MIN to T MAX , unless otherwise specified. XTAL frequency 8.704MHz ±30ppm.
Typical values are at T A = +25°C .) (Note 2)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Supply Voltage
Supply Current
V CC
I CC
Guaranteed by PSRR
3.0
23
5.5
35
V
mA
Logic Supply Voltage
Logic Supply Current
V L
I L
Guaranteed by logic supply current
V TXIN = 3.3V
1.6
138
5.5
380
V
F A
Receiver Power-Supply
Rejection Ratio
Output Power-Supply
Rejection Ratio
PSRR
3.0V P V CC P 5.5V, V TXIN = 3.3V
(Note 3)
3.0V P V CC P 5.5V, V TXIN = 0V
(Note 4)
49
49
60
60
dB
dB
LOGIC INPUTS AND OUTPUTS
Logic-Input High Threshold
Voltage
Logic-Input Low Threshold
Voltage
Logic-Output High Threshold
Voltage
Logic-Output Low Threshold
Voltage
V IH
V IL
V OH
V OL
DIRMD1, DIRMD2, TXIN
DIRMD1, DIRMD2, TXIN
RXOUT, DIR source 3.3mA
RXOUT, DIR sink 3.3mA
0.7 x V L
0.9 x V L
0.3 x V L
0.1 x V L
V
V
V
V
TXIN shorted to GND or V L
Q 1
Input Leakage Current
I IH , I IL
DIRMD1, DIRMD2
Shorted to GND
Shorted to V L
+60
-1
F A
SYNC INPUT (XTAL1) AND OUTPUT (SYNCOUT)
Input High Threshold Voltage
V XTAL1_IH
0.7 x
V CC
V
2
______________________________________________________________________________________
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