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参数资料
| 型号： | MB4S/30-E3 |
| 厂商： | VISHAY SEMICONDUCTORS |
| 元件分类： | 参考电压二极管 |
| 英文描述： | 0.5 A, 400 V, SILICON, BRIDGE RECTIFIER DIODE, TO-269AA |
| 封装： | PLASTIC, MBS, 4 PIN |
| 文件页数： | 1/2页 |
| 文件大小： | 42K |
| 代理商： | MB4S/30-E3 |
Mounting Pad Layout
MB2S thru MB6S
Miniature Glass Passivated Single-Phase
Surface Mount Bridge Rectifier
Reverse Voltage 200 to 600V
Forward Current 0.5A
Maximum Ratings and Thermal Characteristics (TA = 25°C unless otherwise noted)
Parameter
Symbol
MB2S
MB4S
MB6S
Unit
Device marking code
2
4
6
Maximum repetitive peak reverse voltage
VRRM
200
400
600
V
Maximum RMS voltage
VRMS
140
280
420
V
Maximum DC blocking voltage
VDC
200
400
600
V
Maximum average forward output rectified current
(see Fig. 1)
on glass-epoxy P.C.B.
IF(AV)
0.5(1)
A
on aluminum substrate
0.8(2)
Peak forward surge current 8.3msec single half sine-wave
superimposed on rated load (JEDEC Method)
IFSM
35
A
Rating for fusing (t < 8.3ms)
I2t
5.0
A2sec
R
ΘJA
85(1)
Typical thermal resistance per leg
R
ΘJA
70(2)
°C/W
R
ΘJL
20(1)
Operating junction and storage temperature range
TJ, TSTG
–55 to +150
°C
Electrical Characteristics (TA = 25°C unless otherwise noted)
Max. instantaneous forward voltage drop per leg at 4.0A
VF
1.0
V
Maximum DC reverse current at
TA = 25°C
5.0
A
rated DC blocking voltage per leg
TA = 125°C
IR
100
Typical junction capacitance per leg(3)
CJ
13
pF
Notes: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads
(2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad
(3) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
Mechanical Data
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable
per MIL-STD-750, Method 2026
Mounting Position: Any Weight: 0.078 oz., 0.22 g
Packaging codes/options: 30/3K per 13” Reel (12mm tape)
0.029 (0.74)
0.017 (0.43)
0-8
o
0.049 (1.24)
0.039 (0.99)
0.062 (1.57)
0.058 (1.47)
0.016 (0.41)
0.006 (0.15)
0.018 (0.46)
0.014 (0.36)
0.008 (0.20)
0.004 (0.10)
0.114 (2.90)
0.110 (2.80)
0.058 (1.47)
0.054 (1.37)
0.252 (6.40)
0.272 (6.90)
0.106 (2.70)
0.090 (2.30)
0.0075 (0.19)
0.0065 (0.16)
0.105 (2.67)
0.095 (2.41)
0.195 (4.95)
0.179 (4.55)
0.144 (3.65)
0.161 (4.10)
0.205 (5.21)
0.195 (4.95)
0.114 (2.90)
0.094 (2.40)
0.038 (0.96)
0.019 (0.48)
Dimensions in inches
and (millimeters)
TO-269AA (MBS)
6/15/00
0.272 MAX.
(6.91 MAX.)
0.105(2.67)
0.095(2.41)
0.030 MIN.
(0.76 MIN.)
0.023 MIN.
(0.58 MIN.)
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
This series is UL recognized under Component Index,
file number E54214
Glass passivated chip junctions
High surge overload rating: 35A peak
Saves space on printed circuit boards
High temperature soldering guaranteed: 260°C/10 seconds.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MB4S-E3 | 制造商:Vishay Intertechnologies 功能描述:MB4S-E3 |
| MB4S-E3/45 | 功能描述:桥式整流器 400 Volt 0.5 Amp 35 Amp IFSM RoHS:否 制造商:Vishay 产品:Single Phase Bridge 峰值反向电压:1000 V 最大 RMS 反向电压: 正向连续电流:4.5 A 最大浪涌电流:450 A 正向电压下降:1 V 最大反向漏泄电流:10 uA 功率耗散: 最大工作温度:+ 150 C 长度:30.3 mm 宽度:4.1 mm 高度:20.3 mm 安装风格:Through Hole 封装 / 箱体:SIP-4 封装:Tube |
| MB4S-E3/80 | 功能描述:桥式整流器 400 Volt 0.5 Amp 35 Amp IFSM RoHS:否 制造商:Vishay 产品:Single Phase Bridge 峰值反向电压:1000 V 最大 RMS 反向电压: 正向连续电流:4.5 A 最大浪涌电流:450 A 正向电压下降:1 V 最大反向漏泄电流:10 uA 功率耗散: 最大工作温度:+ 150 C 长度:30.3 mm 宽度:4.1 mm 高度:20.3 mm 安装风格:Through Hole 封装 / 箱体:SIP-4 封装:Tube |
| MB4S-G | 制造商:COMCHIP 制造商全称:Comchip Technology 功能描述:Glass Passivated Bridge Rectifiers |
| MB4SH0C2 | 制造商:HellermannTyton 功能描述:Cable Ties Screw Mount Polyamide 6/6 Black Bag |
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