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参数资料
| 型号： | MB91F639ABGL |
| 厂商： | FUJITSU LTD |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PBGA144 |
| 封装： | 12 X 12 MM, 1.45 MM HEIGT, 0.80 MM PITCH, PLASTIC, PFBGA-144 |
| 文件页数： | 77/136页 |
| 文件大小： | 4123K |
| 代理商： | MB91F639ABGL |
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MB91635A Series
DS07-16909-2E
45
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the FUJITSU
SEMICONDUCTOR recommended conditions for baking.
Condition: +125
°C / 24 h
Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the
following precautions:
(a) Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion
generation may be needed to remove electricity.
(b) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
(c) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance
(on the level of 1 M
Ω). Wearing of conductive clothing and shoes, use of conductive floor mats and other
measures to minimize shock loads is recommended.
(d) Ground all fixtures and instruments, or protect with anti-static measures.
(e) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.
3.
Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described above.
For reliable performance, do the following:
(1) Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high
humidity levels are anticipated, consider anti-humidity processing.
(2) Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation.
In such cases, use anti-static measures or processing to prevent discharges.
(3) Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely
affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect
the devices.
(4) Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users
should provide shielding as appropriate.
(5) Smoke, Flame
Note: Plastic molded devices are flammable, and therefore should not be used near combustible substances.
If devices begin to smoke or burn, there is danger of the release of toxic gases.
Customers considering the use of FUJITSU SEMICONDUCTOR products in other special environmental con-
ditions should consult with sales representatives.
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