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参数资料
| 型号： | MB9AF116NPMC |
| 厂商： | FUJITSU LTD |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP100 |
| 封装： | 14 X 14 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-100 |
| 文件页数： | 53/108页 |
| 文件大小： | 1221K |
| 代理商： | MB9AF116NPMC |
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MB9A110 Series
HANDLING DEVICES
Power supply pins
In products with multiple VCC and VSS pins, respective pins at the same potential are interconnected
within the device in order to prevent malfunctions such as latch-up. However, all of these pins should be
connected externally to the power supply or ground lines in order to reduce electromagnetic emission levels,
to prevent abnormal operation of strobe signals caused by the rise in the ground level, and to conform to the
total output current rating.
Moreover, connect the current supply source with the VCC and VSS pins of this device at low impedance.
It is also advisable that a ceramic capacitor of approximately 0.1 F be connected as a bypass capacitor
between VCC and VSS near this device.
Crystal oscillator circuit
Noise near the X0/X1 and X0A/X1A pins may cause the device to malfunction. Design the printed circuit
board so that X0/X1, X0A/X1A pins, the crystal oscillator (or ceramic oscillator), and the bypass capacitor
to ground are located as close to the device as possible.
It is strongly recommended that the PC board artwork be designed such that the X0/X1 and X0A/X1A pins
are surrounded by ground plane as this is expected to produce stable operation.
Using an external clock
When using an external clock, the clock signal should be input to the X0,X0A pin only and the X1,X1A pin
should be kept open.
·Example of Using an External Clock
Open
X1(X1A)
X0(X0A)
Device
Handling when using Multi function serial pin as I2C pin
If it is using multi function serial pin as I
2C pins, P-ch transistor of digital output is always disable.
However, I
2C pins need to keep the electrical characteristic like other pins and not to connect to external I2C
bus system with power OFF.
49
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r1.0
DS706-00011-0v01-E
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MB9AF132KAPMC-G-SNE2 | 制造商:Fujitsu 功能描述:Bulk |
| MB9AF132KBPMC-G-SNE2 | 功能描述:IC MCU 32BIT 128KB FLASH 48LQFP 制造商:cypress semiconductor corp 系列:FM3 MB9A130LB 包装:托盘 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:20MHz 连接性:CSIO，I2C，UART/USART 外设:LVD，POR，PWM，WDT I/O 数:37 程序存储容量:128KB（128K x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:8K x 8 电压 - 电源（Vcc/Vdd）:1.8 V ~ 5.5 V 数据转换器:A/D 6x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:48-LQFP 供应商器件封装:48-LQFP（7x7） 标准包装:250 |
| MB9AF132KBQN-G-AVE2 | 功能描述:ARM? Cortex?-M3 FM3 MB9A130LB Microcontroller IC 32-Bit 20MHz 128KB (128K x 8) FLASH 48-QFN (7x7) 制造商:cypress semiconductor corp 系列:FM3 MB9A130LB 包装:托盘 零件状态:有效 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:20MHz 连接性:CSIO，I2C，UART/USART 外设:LVD，POR，PWM，WDT I/O 数:37 程序存储容量:128KB（128K x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:8K x 8 电压 - 电源（Vcc/Vdd）:1.8 V ~ 5.5 V 数据转换器:A/D 6x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:48-VFQFN 裸露焊盘 供应商器件封装:48-QFN（7x7） 标准包装:260 |
| MB9AF132KQN-G-AWE2 | 制造商:FUJITSU 功能描述: |
| MB9AF132LAPMC1-G-SNE2 | 制造商:FUJITSU 功能描述: 制造商:Fujitsu 功能描述:Bulk |
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