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参数资料
| 型号： | MB9BF218THBGL |
| 厂商： | FUJITSU LTD |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, RISC MICROCONTROLLER, PBGA192 |
| 封装： | 12 X 12 MM, 1.45 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, FBGA-192 |
| 文件页数： | 84/128页 |
| 文件大小： | 1205K |
| 代理商： | MB9BF218THBGL |
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59
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r1.0
MB9B210T Series
DS706-00015-0v01-E
·
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from
electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards
in the design of products.
·
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and equipment
such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions.
·
Precautions Related to Usage of Devices
FUJITSU SEMICONDUCTOR semiconductor devices are intended for use in standard applications
(computers, office automation and other office equipment, industrial, communications, and measurement
equipment, personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or
abnormal operation may directly affect human lives or cause physical injury or property damage, or where
extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea
floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult
with sales representatives before such use. The company will not be responsible for damages arising from
such use without prior approval.
2. Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance
during soldering, you should only mount under FUJITSU SEMICONDUCTOR's recommended conditions.
For detailed information about mount conditions, contact your sales representative.
·
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the
board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the
soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for
storage temperature. Mounting processes should conform to FUJITSU SEMICONDUCTOR recommended
mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can
lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment
of socket contacts and IC leads be verified before mounting.
·
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are
more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in
increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. FUJITSU SEMICONDUCTOR recommends the solder
reflow method, and has established a ranking of mounting conditions for each product. Users are advised to
mount packages in accordance with FUJITSU SEMICONDUCTOR ranking of recommended conditions.
·
Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic
soldering, junction strength may be reduced under some conditions of use.
·
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions
will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed
moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent,
do the following:
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MB9BF218TPMC-GE1 | 功能描述:ARM? Cortex?-M3 FM3 MB9B210T Microcontroller IC 32-Bit 144MHz 1MB (1M x 8) FLASH 176-LQFP (24x24) 制造商:cypress semiconductor corp 系列:FM3 MB9B210T 包装:托盘 零件状态:有效 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:144MHz 连接性:CSIO，EBI/EMI，以太网，I2C，LIN，UART/USART，USB 外设:DMA，LVD，POR，PWM，WDT I/O 数:154 程序存储容量:1MB（1M x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:128K x 8 电压 - 电源（Vcc/Vdd）:2.7 V ~ 5.5 V 数据转换器:A/D 32x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:176-LQFP 供应商器件封装:176-LQFP（24x24） 标准包装:40 |
| MB9BF300 | 制造商:FUJITSU 制造商全称:Fujitsu Component Limited. 功能描述:32-bit MCUs with ARM Cortex-M3 Core |
| MB9BF306NAPMC-G-JNE1 | 制造商:FUJITSU 功能描述:MCU 32BIT CORTEX-M3 FM3 100LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 100LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 100LQFP; Controller Family/Series:ARM Cortex-M3; Core Size:32bit; No. of I/O's:80; Supply Voltage Min:2.7V; Supply Voltage Max:5.5V; Digital IC Case Style:LQFP; No. of Pins:100; Program Memory Size:512KB; ;RoHS Compliant: Yes |
| MB9BF306NBGL-GE1 | 制造商:FUJITSU 功能描述:32-bit FM3 series microcontroller |
| MB9BF306NBPMC-G-JNE1 | 制造商:FUJITSU 功能描述:32-bit MCU |
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