参数资料
型号: MC100EL52D
厂商: ON Semiconductor
文件页数: 2/9页
文件大小: 0K
描述: IC FLIP FLOP ECL DIFF CLK 8SOIC
产品变化通告: Product Obsolescence 11/Feb/2009
标准包装: 98
系列: 100EL
功能: 标准
类型: D 型
输出类型: 差分
元件数: 1
每个元件的位元数: 1
频率 - 时钟: 2.8GHz
延迟时间 - 传输: 365ps
触发器类型: 正边沿
电源电压: 4.2 V ~ 5.7 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
包装: 管件
其它名称: MC100EL52DOS
MC10EL52, MC100EL52
http://onsemi.com
2
Figure 1. Logic Diagram and Pinout Assignment
1
2
3
45
6
7
8
Q
VEE
VCC
D
Q
CLK
D
Table 1. TRUTH TABLE
D*
L
H
CLK*
Z
Q
L
H
Z = LOW to HIGH Transition
D, D
ECL Data Input
CLK, CLK
ECL Clock Input
Q, Q
ECL Data Output
VCC
Positive Supply
VEE
Negative Supply
Table 2. PIN DESCRIPTION
PIN
FUNCTION
* Pin will default low when left open.
EP
(DFN8 only) Thermal exposed
pad must be connected to a suf-
ficient thermal conduit. Electric-
ally connect to the most negative
supply (GND) or leave uncon-
nected, floating open.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI VCC
VI VEE
6
V
Iout
Output Current
Continuous
Surge
50
100
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
8 SOIC
190
130
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
8 SOIC
41 to 44
°C/W
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
8 TSSOP
185
140
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
8 TSSOP
41 to 44 ± 5%
°C/W
Tsol
Wave Solder
Pb
PbFree
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
°C
qJC
Thermal Resistance (JunctiontoCase)
(Note 1)
DFN8
35 to 40
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board 2S2P (2 signal, 2 power)
相关PDF资料
PDF描述
MV036T060M020 MIL-COTS VTM CURRENT MULTIPLIER
VE-2T4-MV-F4 CONVERTER MOD DC/DC 48V 150W
NBSG53AMN IC FLIP FLOP DIFF CLOCK 16QFN
D38999/20FG75PNLC CONN HSG RCPT 4POS WALL MT PINS
MC100EL35D IC FLIP FLOP JK ECL 5V HS 8SOIC
相关代理商/技术参数
参数描述
MC100EL52DG 功能描述:触发器 5V ECL Diff Data And Clock D-Type RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
MC100EL52DG 制造商:ON Semiconductor 功能描述:FLIP-FLOP LOGIC IC
MC100EL52DR2 功能描述:触发器 5V ECL Diff Data And RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
MC100EL52DR2G 功能描述:触发器 5V ECL Diff Data And Clock D-Type RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
MC100EL52DT 功能描述:触发器 5V ECL Diff Data And RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel