参数资料
型号: MC33275ST-3.0T3G
厂商: ON Semiconductor
文件页数: 13/14页
文件大小: 0K
描述: IC REG LDO 3V .3A SOT223
标准包装: 1
稳压器拓扑结构: 正,固定式
输出电压: 3V
输入电压: 最高 13V
电压 - 压降(标准): 0.26V @ 300mA
稳压器数量: 1
电流 - 输出: 300mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223
包装: 剪切带 (CT)
其它名称: MC33275ST-3.0T3GOSCT
MC33275, NCV33275
PACKAGE DIMENSIONS
8 PIN DFN, 4x4
MN SUFFIX
CASE 488AF
ISSUE C
2X
PIN ONE
REFERENCE
0.15 C
D
A
B
E
L1
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL
CONSTRUCTIONS FOR TERMINALS.
MILLIMETERS
8X
2X 0.15 C
0.10 C
0.08 C
NOTE 4
TOP VIEW
DETAIL B
(A3)
SIDE VIEW
A1
A
C
EXPOSED Cu
SEATING
PLANE
MOLD CMPD
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MIN MAX
0.80 1.00
0.00 0.05
0.20 REF
0.25 0.35
4.00 BSC
1.91 2.21
4.00 BSC
2.09 2.39
0.80 BSC
0.20 ???
0.30 0.50
??? 0.15
DETAIL A
1
D2
4
8X
L
SOLDERING FOOTPRINT*
2.21
8X
0.63
E2
K
e
8
5
8X
b
0.10 C A B
0.05 C NOTE 3
4.30 2.39
PACKAGE
OUTLINE
BOTTOM VIEW
0.80
PITCH
8X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
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