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参数资料
| 型号： | MC33275ST-3.0T3G |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/14页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3V .3A SOT223 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3V |
| 输入电压： | 最高 13V |
| 电压 - 压降（标准）： | 0.26V @ 300mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 300mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-261-4，TO-261AA |
| 供应商设备封装： | SOT-223 |
| 包装： | 剪切带 (CT) |
| 其它名称： | MC33275ST-3.0T3GOSCT |
MC33275, NCV33275
DEFINITIONS
Pd + J
T * T
q JA
D
I out + V
Load Regulation ? The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage ? The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage ? The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation ? The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current ? Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation ? The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
A
R
The maximum operating junction temperature T J is
specified at 150 ° C, if T A = 25 ° C, then P D can be found. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
P
CC * Vout
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature and ambient temperature.
+ J
T * T
D
affected.
Maximum Package Power Dissipation ? The maximum
package power dissipation is the power dissipation level at
R
q JA
P
A
which the junction temperature reaches its maximum value
i.e. 150 ° C. The junction temperature is rising while the
difference between the input power (V CC X I CC ) and the
output power (V out X I out ) is increasing.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC33275ST-5.0T3 | 功能描述:低压差稳压器 - LDO 5.0V 300mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| MC33275ST-5.0T3G | 功能描述:低压差稳压器 - LDO 5.0V 300mA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| MC33275ST-5.0T3G | 制造商:ON Semiconductor 功能描述:Linear Voltage Regulator IC |
| MC33276 | 制造商:SPC Multicomp 功能描述:HEATSINK TO218/220 7/W CLIP/HOLE 制造商:SPC Multicomp 功能描述:HEATSINK TO218/220 7C/W CLIP/HOLE 制造商:SPC Multicomp 功能描述:HEAT SINK; Packages Cooled:TO-218 / TO-220 / TO-247; Thermal Resistance:7C/W; External Height - Imperial:1.378"; External Height - Metric:35mm; External Width - Imperial:2.008"; External Width - Metric:51mm; Height:35mm; Width:51mm ;RoHS Compliant: Yes |
| MC33277 | 制造商:SPC Multicomp 功能描述:HEATSINK TO220 28/W 制造商:SPC Multicomp 功能描述:HEATSINK TO220 28C/W 制造商:SPC Multicomp 功能描述:HEAT SINK; Packages Cooled:TO-220; Thermal Resistance:28C/W; External Height - Imperial:0.787"; External Height - Metric:20mm; External Width - Imperial:0.776"; External Width - Metric:19.7mm; External Length - Imperial:0.319" ;RoHS Compliant: Yes |
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