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参数资料
| 型号： | MC33288DDHR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 9/15页 |
| 文件大小： | 0K |
| 描述： | IC SSR FLASHER DUAL HSIDE 20HSOP |
| 标准包装： | 750 |
| 类型： | 高端 |
| 输入类型： | 非反相 |
| 输出数： | 2 |
| 导通状态电阻： | 20 毫欧 |
| 电流 - 输出 / 通道： | 8A |
| 电流 - 峰值输出： | 30A |
| 电源电压： | 8 V ~ 35 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 |
| 供应商设备封装： | 20-HSOP |
| 包装： | 带卷 (TR) |
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
This paragraph is boilerplate - you may add to it but, can not change wording. You may change numeric values
An external resistor must be connected to the CUR R
terminal and then tied to a microcontroller A/D input for
analog voltage measurement. The CUR R terminal is
internally clamped to protect the MCU A/D input.
Warning Lamp Driver
The warning lamp driver is a 3.2 ? R DSON maximum
high-side MOSFET to control the 1.2 W dashboard warning
lamp. This output is current limited and thermally
protected-activated only in the warning mode. It is turned on
by activation of both right and left inputs (IN1 and IN2).
Down side pcb
8 cm 2
HSOP20
Thermal
via from
top to down
Top side pcb
2 cm 2
Package
The device is assembled into a power surface mount
package. This package offers high thermal performances
and high current capabilities. It offers 10 terminals on each
package sides and an additional terminal which is the
package heat sink , called terminal 21. The heak sink acts as
the MC33288 power V BAT connection.
Soldering Information
This device is packaged in a Surface Mount Power
package indended to be soldered directly on the Printed
Circuit Board.
This device was qualified according to JEDEC standards
JESD22-A113-B and J-STD-020A with the reflow conditions
applicable for packages with thickness above 2.5 mm:
Convection 220°C +5/-0°C
VPR 215-219°C
IR / Convection 220°C +5/-0°C
The maximum peak temperature during the soldering
process should not exceed 220°C (+5°C/-0°C). The time at
maximum temperature should range from 10 to 40s
maximum.
side pcb
external pcb (4x4 cm)
Figure 3. Printed Board Layout Example (not to scale)
Figure 1 shows an example of printed circuit board layout.
It has a total of 10 cm 2 additional copper on two sides (2.5
cm 2 on the top side and 7.5 cm 2 on the down side).
With the above layout, thermal resistance junction to
ambient of 25 ° C/W can be achieved, this value being split
into:
? junction to case : R θ JC1 = R θ JC2 = 2 ° C/W
? case to ambient : R θ CA = 23 ° C/W
Lower value can be reached with the help of larger and
thicker copper metal, higher number of thermal via from top
to down side pcb and the use of additional thermal via from
the circuit board to the module case.
Steady State Thermal Model
The junction to ambient thermal resistance of the circuit
mounted on a printed circuit board can be split into two main
parts: junction to case and case to ambient resistances.
A simplified steady state model is shown in Figure 2.
Thermal Management
The junction to case thermal resistance is 2 ° C/W
maximum. The junction to ambient thermal resistance is
dependent on the mounting technology and the addition of
heat sink. One of the most commonly used mounting
techniques consists of using the printed circuit board and the
copper lines as heat sink.
Chan 1 Junction
Temp Node
(Volts represent Die
Surface Temperature)
Chan 1
Switch
Temp Node
Chan 2 Junction
Chan 2
Switch
Chan 1
Power (W)
(1.0A=1W of
R θ JC1
2°C/W
R θ JC2
2°C/W
Case Temp Node
Chan 2
Power (W)
Power Dissipation)
Rthca
(1.0 ? =1 ° C/W)
25°C/W
Ambient Temp Node
(1.0V=1 ° C)
AmbientTemperature
Figure 4. Simplified Thermal Model (Electrical
Equivalent)
33288
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
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| MC33289 | 制造商:SPC Multicomp 功能描述:HEATSINK TO220 10.2/W 3 HOLES 制造商:SPC Multicomp 功能描述:HEATSINK TO220 10.2C/W 3 HOLES 制造商:SPC Multicomp 功能描述:HEAT SINK; Packages Cooled:TO-220; Thermal Resistance:10.2C/W; External Height - Imperial:1.496"; External Height - Metric:38mm; External Width - Imperial:1.358"; External Width - Metric:34.5mm; External Length - Imperial:0.492" ;RoHS Compliant: Yes |
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| MC33289DWR2 | 功能描述:电源开关 IC - 配电 DUAL HIGH SIDE SWITCH RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| MC33290 | 制造商:SPC Multicomp 功能描述:HEATSINK TO220 8.8/W 3 HOLES 制造商:SPC Multicomp 功能描述:HEATSINK TO220 8.8C/W 3 HOLES 制造商:SPC Multicomp 功能描述:HEAT SINK; Packages Cooled:TO-220; Thermal Resistance:8.8C/W; External Height - Imperial:1.969"; External Height - Metric:50mm; External Width - Imperial:1.358"; External Width - Metric:34.5mm; External Length - Imperial:0.492" ;RoHS Compliant: Yes |
| MC33290D | 功能描述:IC SER LNK INTER ISO KLINE 8SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 专用 系列:- 标准包装:3,000 系列:- 应用:PDA，便携式音频/视频，智能电话 接口:I²C，2 线串口 电源电压:1.65 V ~ 3.6 V 封装/外壳:24-WQFN 裸露焊盘 供应商设备封装:24-QFN 裸露焊盘（4x4） 包装:带卷 (TR) 安装类型:表面贴装 产品目录页面:1015 (CN2011-ZH PDF) 其它名称:296-25223-2 |
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