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| 型号： | MC33290DR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 7/12页 |
| 文件大小： | 0K |
| 描述： | IC SER LNK INTER ISO KLINE 8SOIC |
| 标准包装： | 1 |
| 应用： | 自动 |
| 接口： | 串行 |
| 电源电压： | 8 V ~ 18 V |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 剪切带 (CT) |
| 安装类型： | 表面贴装 |
| 其它名称： | MC33290DR2CT |
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33290
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ARCHIVE
INFORMATION
ARCHIVE
INFORMATION
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
VDD DC Supply Voltage
VDD
-0.3 to 7.0
V
VBB Load Dump Peak Voltage
VBB(LD)
45
V
ISO Pin Load Dump Peak Voltage (2)
VISO
40
V
ISO Short Circuit Current Limit
IISO(LIM)
1.0
A
ESD Voltage (3)
Human Body Model (4)
Machine Model (4)
VESD1
VESD2
±2000
±200
V
ISO Clamp Energy (5)
Eclamp
10
mJ
Storage Temperature
Tstg
-55 to +150
°C
Operating Case Temperature
TC
-40 to +125
°C
Operating Junction Temperature
TJ
-40 to +150
°C
Power Dissipation
TA = 25°C
PD
0.8
W
Peak Package Reflow Temperature During Reflow (6), (7)
TPPRT
°C
Thermal Resistance
Junction-to-Ambient
RθJA
150
°C/W
Notes
2.
Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain
within specified parametric limits during this duration.
3.
ESD data available upon request.
4.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
5.
Nonrepetitive clamping capability at 25
°C.
6.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7.
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