参数资料
型号: MC33399
厂商: 飞思卡尔半导体(中国)有限公司
英文描述: “Local Interconnect Network” Physical Interface(“本地互联网”(LIN)物理接口)
中文描述: “本地互连网络”物理接口(“本地互联网”(林)物理接口)
文件页数: 1/9页
文件大小: 282K
代理商: MC33399
Advance Information
Automotive “Local Interconnect
Network” Physical Interface
MC33399
SILICON MONOLITHIC
INTEGRATED CIRCUIT
(Top view)
1
2
3
4
5
6
7
PIN CONNECTIONS
8
RX
EN
Wake
TX
INH
Vsup
LIN
gnd
LIN INTERFACE
8
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO-8)
ORDERING INFORMATION
Device
Operating Temperature
Range
Package
SO-8
- 40
°
C to+125
°
C
Simplified Block Diagram
Rxd
Txd
EN
LIN
VSUP
V. ref
Bias
Logic
Gnd
Driver
Receiver
INH
Protection
MC33399
Wake up
V-Reg Ctrl
Wake
30k
_
Semiconductor Technical Data
MOTOROLA
Order Number: MC33399/D
Rev. 4.0, 08/2001
This document contains information on a new product. Specifications and
information herein are subject to change without notice.
Motorola, Inc., 2001. All rights reserved.
TM
1
The MC33399 is a Physical Layer component dedicated to automotive sub
bus applications. The device is compliant to LIN specification. Its main
features are:
Speed Communication from 1 to 20Kb/s
Nominal Operation from VSUP 8 to 18V DC
Fully Functional up to 27V DC battery voltage.
40V maximum Voltage during Load Dump
Handle from +40V to -18V DC voltage at LIN pin
Gnd disconnection fail safe at module level
An Unpowered Node does not disturb the network
GND Shift Operation at system level
Two Operation Modes: Normal and Sleep Mode
Very Low Standby Current during Sleep Mode 20uA
Wake-up Capability from LIN bus, MCU command and dedicated high
voltage wake up input (interface to external switch)
Interface to MCU with CMOS compatible I/O pins
Control of External Voltage Regulator
LIN bus Threshold Voltage fully Compatible with LIN protocol specification
Bus slew rate control according to LIN protocol specification
recommendations (2V/us typ.)
Internal pull up resistor
Handle Automotive Transients per ISO9137 Specification
ESD 4KV on LIN bus Pin
High EMC Immunity
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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