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参数资料
| 型号： | MC33661 |
| 厂商： | 飞思卡尔半导体(中国)有限公司 |
| 英文描述： | LIN Enhanced Physical Interface(LIN网增强型物理接口) |
| 中文描述： | 林增强型物理接口（林网增强型物理接口） |
| 文件页数： | 1/20页 |
| 文件大小： | 377K |
| 代理商： | MC33661 |
RXD
33661
MCU
TXD
EN
WAKE
LIN
GND
INH
V
SUP
LIN Bus
V
PWR
12.0 V / 5.0 V
Regulator
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
Motorola, Inc. 2004
Document order number: MC33661
Rev 3.0, 10/2004
33661
Advance Information
LIN Enhanced Physical Interface
Local Interconnect Network (LIN) is a serial communication protocol
designed to support automotive networks in conjunction with Controller Area
Network (CAN). As the lowest level of a hierarchical network, LIN enables
cost-effective communication with sensors and actuators when all the features
of CAN are not required.
The 33661 is a Physical Layer component dedicated to automotive LIN sub-
bus applications. It offers slew rate selection for optimized operation at
10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and
programming modes
,
excellent radiated emission performance, and safe
behavior in the event of LIN bus short-to-ground or LIN bus leakage during
low-power mode.
Features
Operational from V
SUP
6.0 V to 18 V DC, Functional up to 27 V DC, and
Handles 40 V During Load Dump
Active Bus Waveshaping Offering Excellent Radiated Emission
Performance
5.0 kV ESD on LIN Bus Terminal
30 k
Internal Pullup Resistor
LIN Bus Short-to-Ground or High Leakage in Sleep Mode
-18 V to +40 V DC Voltage at LIN Terminal
8.0
μ
A Standby Current in Sleep Mode
Local and Remote Wake-Up Capability Reported by INH and RXD
Terminals
5.0 V and 3.3 V Compatible Digital Inputs Without Any External
Components Required
LIN INTERFACE
ORDERING INFORMATION
Device
Temperature
Range (T
A
)
Package
MC33661D/R2
-40°C to 125°C
8 SOICN
D SUFFIX
CASE 751-06
8-TERMINAL SOICN
33661 Simplified Application Diagram
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
相关PDF资料 |
PDF描述 |
|---|---|
| MC33689 | System Basis Chip with LIN transceiver(带LIN收发器的系统基片) |
| MC33701 | 1.5 A Switch-Mode Power Supply with Linear Regulator(1.5 A开关方式电源，带线性稳压器) |
| MC33702 | 3.0 A Switch-Mode Power Supply with Linear Regulator(3.0 A开关方式电源，带线性稳压器) |
| MC33742 | System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver(带增强型高速CAN收发器的系统基片) |
| MC33790 | Two-Channel Distributed System Interface (DSI) Physical Interface Device(2通道分布式系统接口（DSI）物理接口) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC33661PEF | 功能描述:LIN 收发器 ENHANCED LIN INTERFACE RoHS:否 制造商:NXP Semiconductors 工作电源电压: 电源电流: 最大工作温度: 封装 / 箱体:SO-8 |
| MC33661PEFR2 | 功能描述:LIN 收发器 ENHANCED LIN INTERFACE RoHS:否 制造商:NXP Semiconductors 工作电源电压: 电源电流: 最大工作温度: 封装 / 箱体:SO-8 |
| MC33662BLEF | 功能描述:IC TXRX LIN 2.1 10KBPS 8SOIC 制造商:nxp usa inc. 系列:- 包装:管件 零件状态:在售 类型:收发器 协议:LIN 驱动器/接收器数:1/1 双工:- 数据速率:20kbps 电压 - 电源:7 V ~ 18 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商器件封装:8-SOIC 标准包装:98 |
| MC33662JEF | 功能描述:LIN 收发器 LINcell RoHS:否 制造商:NXP Semiconductors 工作电源电压: 电源电流: 最大工作温度: 封装 / 箱体:SO-8 |
| MC33662JEFR2 | 功能描述:LIN 收发器 LINcell RoHS:否 制造商:NXP Semiconductors 工作电源电压: 电源电流: 最大工作温度: 封装 / 箱体:SO-8 |
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