参数资料
型号: MC33794DWB/R2
厂商: MOTOROLA INC
元件分类: 模拟信号调理
英文描述: Electric Field Imaging Device
中文描述: SPECIALTY ANALOG CIRCUIT, PDSO54
封装: PLASTIC, SOICW-54
文件页数: 10/23页
文件大小: 574K
代理商: MC33794DWB/R2
33794
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
18
DWB SUFFIX
54-LEAD SOICW-EP
CASE 1390-01
ISSUE B
NOTES:
1.
ALL DIMENSIONS ARE IN MILLIMETERS.
2.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3.
DATUMSB AND C TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
4.
THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED
0.15MM PER SIDE.THISDIMENSIONISDETERMINED
AT THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
5.
THIS DIMENSION DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER
SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6.
THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED
0.46 MM. DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSION AND ADJACENT LEAD
SHALL NOT LESS THAN 0.07 MM.
7.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8.
THESE DIMENSIONS APPLY TO THE FLAT SECTION
OF THE LEAD BETWEEN 0.1 MM AND 0.3 MM FROM
THE LEAD TIP.
9.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH,
TIE BAR BURRS, GATE BURRS AND INTER-LEAD
FLASH, BUT INCLUDING ANY MISMATCH BETWEEN
THE TOP AND BOTTOM OF THE PLASTIC BODY.
CL
17.8
7.4
1
27
28
54
0.10
A
2.35
SEATING
PLANE
0.9
SECTION B-B
0.65
R0.08 MIN
B
A
(0.29)
0.38
0.30
(0.25)
PLATING
BASE METAL
SECTION A-A
ROTATED 90 CLOCKWISE
°
8
0.25
0.22
9
5
0.13 M
C
AB
6
A
C
7.6
18.0
9
4
10.3
5.15
A
54X
52X
2.65
0.3 A
2X 27 TIPS
B C
BB
0.1
0.0
0.5
0°
8°
0°
0.25
GAUGE PLANE
MIN
PIN 1 INDEX
C
(1.43)
4.8
4.3
0.30
C
AB
4.8
4.3
0.30
C
AB
VIEW C-C
PLASTIC PACKAGE
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