参数资料
型号: MC33794DWB/R2
厂商: MOTOROLA INC
元件分类: 模拟信号调理
英文描述: Electric Field Imaging Device
中文描述: SPECIALTY ANALOG CIRCUIT, PDSO54
封装: PLASTIC, SOICW-54
文件页数: 9/23页
文件大小: 574K
代理商: MC33794DWB/R2
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33794
17
PACKAGE DIMENSIONS
SEATING
PLANE
DATUM
PLANE
BOTTOM VIEW
A
X 45
E1
E
D
h
e
42
X
B
M
bbb
C
44
23
22
1
E2
°
D2
D1
E3
A2
SECTION W-W
b
c1
b1
c
E4
A
M
aaa
C
EXPOSED
HEATSINK AREA
A
B
C
H
PIN ONE ID
22X
Y
GAUGE
PLANE
DETAIL Y
(1.600)
L
W
q
bbb C
L1
A1
0.325
NOTES:
1.
CONTROLLING DIMENSION: MILLIMETER.
2.
DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
3.
DATUM PLANE -H- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
4.
DIMENSIONS D AND E1 DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.150 PER SIDE.
DIMENSIONS D AND E1 DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE -H-.
5.
DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN
EXCESS OF THE b DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6.
DATUMS -A- AND -B- TO BE DETERMINED AT
DATUM PLANE -H-.
7.
DIMENSION D DOES NOT INCLUDE TIEBAR
PROTRUSIONS. ALLOWABLE TIEBAR
PROTRUSIONS ARE 0.150 PER SIDE.
DIM
MIN
MAX
MILLIMETERS
A
3.000 3.400
A1
0.025 0.125
A2
2.900 3.100
D 15.800 16.000
D1 11.700 12.600
D2
0.900 1.100
E 13.950 14.450
E1 10.900 11.100
E2
2.500 2.700
E3
6.400 7.300
E4
2.700 2.900
L
0.840 1.100
L1
0.350 BSC
b
0.220 0.350
b1
0.220 0.320
c
0.230 0.320
c1
0.230 0.280
e
0.650 BSC
h
---
0.800
q
0
8
aaa
0.200
bbb
0.100
°°
E5
--- 1.000
D3
--- 1.000
D3
4X
E5
4X
DH SUFFIX
44-LEAD HSOP
PLASTIC PACKAGE
CASE 1291-01
ISSUE O
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