参数资料
型号: MC33886VWR2
厂商: Freescale Semiconductor
文件页数: 19/28页
文件大小: 0K
描述: IC H-BRIDGE 5.0A 20-HSOP
标准包装: 750
应用: DC 电机控制器,H 桥式
评估套件: 可供
输出数: 1
电流 - 输出: 5A
电源电压: 5 V ~ 40 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-SOIC(0.433",11.00mm 宽)裸露焊盘
供应商设备封装: 20-HSOP
包装: 带卷 (TR)
配用: KIT33886DHEVB-ND - KIT EVAL FOR MC33886 H-BRIDGE
FUNCTIONAL DEVICE OPERATION
PERFORMANCE
PERFORMANCE
The 33886 is designed for enhanced thermal performance.
The significant feature of this device is the exposed copper
pad on which the power die is soldered. This pad is soldered
on a PCB to provide heat flow to ambient and also to provide
thermal capacitance. The more copper area on the PCB, the
better the power dissipation and transient behavior will be.
Example Characterization on a double-sided PCB: bottom
side area of copper is 7.8 cm 2 ; top surface is 2.7 cm 2 (see
Figure 21 ); grid array of 24 vias 0.3 mm in diameter.
Figure 22 shows the thermal response with the device
soldered on to the test PCB described in Figure 21 .
100
10
Rth (?¨DóC
1
0,1
0,001
0,01
0,1
1
10
t, Time (s)
100
1000
10000
Figure 22. 33886 Thermal Response
Top Side
Bottom Side
Figure 21. PCB Test Layout
33886
Analog Integrated Circuit Device Data ?
Freescale Semiconductor
19
相关PDF资料
PDF描述
MC33886DHR2 IC H-BRIDGE 5.0A 20-HSOP
ACC06DRYH CONN EDGECARD 12POS .100 DIP SLD
ACC07DRXN CONN EDGECARD 14POS .100 DIP SLD
ACC07DRXH CONN EDGECARD 14POS .100 DIP SLD
ACC06DRES CONN EDGECARD 12POS .100 EYELET
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