参数资料
型号: MC33972TEW
厂商: Freescale Semiconductor
文件页数: 28/32页
文件大小: 0K
描述: IC SWITCH DETECT SPI 32-SOIC
标准包装: 42
应用: 开关监控
接口: SPI 串行
电源电压: 3.1 V ~ 5.25 V
封装/外壳: 32-SOIC(0.295",7.50mm 宽)
供应商设备封装: 32-SOIC
包装: 管件
安装类型: 表面贴装
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33972
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VDD Supply Voltage
CS,
SI, SO, SCLK, INT, AMUX(1)
-0.3 to 7.0
VDC
WAKE(1)
-0.3 to 40
VDC
VPWR Supply Voltage(1)
-0.3 to 50
VDC
VPWR Supply Voltage at -40
-0.3 to 45
VDC
Switch Input Voltage Range
-14 to 40
VDC
Frequency of SPI Operation (VDD = 5.0 V)
6.0
MHz
Human Body Model(2)
Applies to all non-input pins
Machine Model
Charge Device Model
Corner Pins
Interior Pins
VESD
±2000
±200
750
500
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
TA
TJ
-40 to 125
-40 to 150
°C
Storage Temperature
TSTG
-55 to 150
°C
Power Dissipation (TA = 25 °C)(4)
PD
1.7
W
Thermal Resistance
Non-Exposed Pad
Junction to Ambient
Junction to Lead
Exposed Pad
Junction to Ambient
Junction to Exposed Pad
RθJA
RθJL
RθJA
RθJC
74
25
71
1.2
°C/W
Peak Package Reflow Temperature During Reflow(5), (6)
TPPRT
°C
Notes
1.
Exceeding these limits may cause malfunction or permanent damage to the device.
2.
ESD data available upon request.
3.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), and ESD2 testing is performed
in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
4.
Maximum power dissipation at TJ = 150°C junction temperature with no heat sink used.
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6.
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