参数资料
型号: MC34845EPR2
厂商: Freescale Semiconductor
文件页数: 4/24页
文件大小: 0K
描述: IC DVR LED BACKLIGHT 6CH 24-QFN
标准包装: 2,500
拓扑: PWM,升压(升压)
输出数: 6
内部驱动器:
类型 - 主要: 背光
频率: 600kHz
电源电压: 5 V ~ 21 V
输出电压: 8 V ~ 60 V
安装类型: 表面贴装
封装/外壳: 24-UFQFN 裸露焊盘
供应商设备封装: 24-QFN 裸露焊盘(4x4)
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
Table 2. Absolute Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Maximum Pin Voltages
SWA, SWB, VOUT
CH1, CH2, CH3, CH4, CH5, CH6 (Off state)
CH1, CH2, CH3, CH4, CH5, CH6 (On state)
FAIL
OVP
COMP, ISET
PWM, WAKE
EN, VIN
V MAX
-0.3 to 65
-0.3 to 45
-0.3 to 20
-0.3 to 7.0
-0.3 to 7.75
-0.3 to 2.7
-0.3 to 5.5
-0.3 to 24
V
Maximum LED Current per Channel
I LED_MAX
33
mA
ESD Voltage
(1)
V ESD
V
Human Body Model (HBM)
Machine Model (MM)
THERMAL RATINGS
± 2000
± 200
Operating Ambient Temperature Range
Maximum Junction Temperature
Storage Temperature Range
T A
T J
T S
-40 to 85
150
-40 to 150
°C
°C
°C
Peak Package Reflow Temperature During Reflow
(2) , (3)
T PPRT
Note 3
°C
Thermal Resistance Junction to
Thermal Resistance Junction to
(4)
Power Dissipation
Ambient (4)
Case (5)
T θ JA
T θ JC
P D
36
3.1
°C/W
°C/W
W
TA = 25°C
TA = 85°C
3.4
1.8
Notes
1. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2) (C ZAP = 100 pF, R ZAP = 1500 Ω ), and the
Machine Model (MM) (C ZAP = 200 pF, R ZAP = 0 Ω.
2.
3.
4.
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Per JEDEC51-8 Standard for Multilayer PCB
Theoretical thermal resistance is from the die junction to the exposed pad.
34845
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
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