- 您现在的位置：买卖IC网 > PDF目录80417 > MC56F8247VLH (FREESCALE SEMICONDUCTOR INC) 16-BIT, FLASH, 60 MHz, MICROCONTROLLER, PQFP64 PDF资料下载
参数资料
| 型号： | MC56F8247VLH |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16-BIT, FLASH, 60 MHz, MICROCONTROLLER, PQFP64 |
| 封装： | 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-026BCD, LQFP-64 |
| 文件页数： | 71/88页 |
| 文件大小： | 4050K |
| 代理商： | MC56F8247VLH |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页当前第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页
Design Considerations
MC56F825x/MC56F824x Digital Signal Controller, Rev. 3
Freescale Semiconductor
73
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low-power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a
case-to-ambient thermal resistance.
RθJA = RθJC + RθCA
Eqn. 4
where:
RθJC is device related and cannot be adjusted. You control the thermal environment to change the case to ambient thermal
resistance, RθCA. For instance, you can change the size of the heat sink, the air flow around the device, the interface material,
the mounting arrangement on printed circuit board, or the thermal dissipation on the printed circuit board surrounding the
device.
To determine the junction temperature of the device in the application when heat sinks are not used, the thermal characterization
parameter (
ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of
the package case. Refer to Equation 5.
TJ = TT + (ΨJT x PD)
Eqn. 5
where:
The thermal characterization parameter is measured per JESD51–2 specification using a 40-gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case
of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of
the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to
the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature
and then back-calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.
8.2
Electrical Design Considerations
CAUTION
This device contains protective circuitry to guard against damage due to high static voltage
or electrical fields. However, take normal precautions to avoid application of any voltages
higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate voltage level.
RθJA
=
Package junction-to-ambient thermal resistance (°C/W)
RθJC
=
Package junction-to-case thermal resistance (°C/W)
RθCA
=
Package case-to-ambient thermal resistance (°C/W)
TT
=
Thermocouple temperature on top of package (oC)
ΨJT
=
Thermal characterization parameter (oC/W)
PD
=
Power dissipation in package (W)
相关PDF资料 |
PDF描述 |
|---|---|
| MB89T623PFV | 8-BIT, 10 MHz, MICROCONTROLLER, PQFP64 |
| MSP50C33N | 0-BIT, 19.7 MHz, MIXED DSP, PDIP16 |
| M38067MCAXXXGP | 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP80 |
| M38203E4GP | 8-BIT, OTPROM, 8 MHz, MICROCONTROLLER, PQFP80 |
| MB96F346AWBPMC-GSE2 | 16-BIT, FLASH, 56 MHz, MICROCONTROLLER, PQFP100 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC56F8247VLHR | 制造商:Freescale Semiconductor 功能描述:MICRO CONTROLLER |
| MC56F824X | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Digital Signal Controller Battery chargers and management |
| MC56F8255 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Digital Signal Controller Battery chargers and management |
| MC56F8255MLD | 功能描述:数字信号处理器和控制器 - DSP, DSC DSC 44 LQFP 64K FL RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
| MC56F8255VLD | 功能描述:数字信号处理器和控制器 - DSP, DSC DSC 44 LQFP 64K FL RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
发布紧急采购，3分钟左右您将得到回复。