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参数资料
| 型号： | MC68EC030CFE25C |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 25 MHz, MICROPROCESSOR, CQCC132 |
| 封装： | CERQUAD-132 |
| 文件页数： | 14/48页 |
| 文件大小： | 332K |
| 代理商： | MC68EC030CFE25C |
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MOTOROLA
MC68EC030 TECHNICAL DATA
2 1
The total thermal resistance of a package (
θJA) can be separated into two components, θJC and θCA,
representing the barrier to heat flow from the semiconductor junction to the package (case) surface (
θJC)
and from the case to the outside ambient air (
θCA). These terms are related by the equation:
θJA=θJC + θCA
(4)
θJC is device related and cannot be influenced by the user. However, θCA is user dependent and can
be minimized by such thermal management techniques as heat sinks, ambient air cooling, and thermal
convection. Thus, good thermal management on the part of the user can significantly reduce
θCA so that
θJA approximately equals; θJC. Substitution of θJC for θJA in equation (1) results in a lower
semiconductor junction temperature.
Values for thermal resistance presented in this document, unless estimated, were derived using the
procedure described in Motorola Reliability Report 7843, “Thermal Resistance Measurement Method for
MC68XX Microcomponent Devices,” and are provided for design purposes only. Thermal measurements
are complex and dependent on procedure and setup. User derived values for thermal resistance may
differ.
AC ELECTRICAL SPECIFICATION DEFINITIONS
The AC specifications presented consist of output delays, input setup and hold times, and signal skew
times. All signals are specified relative to an appropriate edge of the clock and possibly to one or more
other signals.
The measurement of the AC specifications is defined by the waveforms shown in Figure 9. To test the
parameters guaranteed by Motorola, inputs must be driven to the voltage levels specified in Figure 9.
Outputs are specified with minimum and/or maximum limits, as appropriate, and are measured as shown in
Figure 9. Inputs are specified with minimum setup and hold times, and are measured as shown. Finally,
the measurement for signal-to-signal specifications is also shown.
Note that the testing levels used to verify conformance to the AC specifications does not affect the
guaranteed DC operation of the device as specified in the DC electrical specifications.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC68EC030FE25B | 制造商:Motorola Inc 功能描述: |
| MC68EC030FE25C | 功能描述:微处理器 - MPU 32B ON-CHIP CACHE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC68EC030FE25CB1 | 功能描述:IC MPU 32BIT ENH 25MHZ 132-CQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:M680x0 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
| MC68EC030FE40B | 制造商:Motorola Inc 功能描述: |
| MC68EC030FE40C | 功能描述:微处理器 - MPU 32B ON-CHIP CACHE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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