参数资料
型号: MC68HC705C9ACFS
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 8-BIT, UVPROM, 2.1 MHz, MICROCONTROLLER
文件页数: 55/177页
文件大小: 1941K
代理商: MC68HC705C9ACFS
Mechanical Specifications
Advance Information
MC68HC705C9A — Rev. 4.0
148
Mechanical Specifications
MOTOROLA
13.3 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)
13.4 42-Pin Plastic Shrink Dual In-Line (SDIP) Package (Case 858-01)
Figure 13-2. 42-Pin Plastic SDIP Package (Case 858-01)
120
40
21
B
A
C
SEATING
PLANE
D
F
G
H
K
N
M
J
L
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
51.69
52.45
2.035
2.065
B
13.72
14.22
0.540
0.560
C
3.94
5.08
0.155
0.200
D
0.36
0.56
0.014
0.022
F
1.02
1.52
0.040
0.060
G
2.54 BSC
0.100 BSC
H
1.65
2.16
0.065
0.085
J
0.20
0.38
0.008
0.015
K
2.92
3.43
0.115
0.135
L
15.24 BSC
0.600 BSC
M
1
°
N
0.51
1.02
0.020
0.040
NOTES:
1.POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2.DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3.DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
°
0
°
0
°
1.435
0.540
0.155
0.014
0.032
0.008
0.115
0.020
1.465
0.560
0.200
0.022
0.046
0.015
0.135
15°
0.040
37.21
14.22
5.08
0.56
1.17
0.38
3.43
15°
1.02
36.45
13.72
3.94
0.36
0.81
0.20
2.92
0.51
-B-
-A-
C
D 42 PL
F
K
G
N
J 42 PL
M
MIN
MAX
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
N
H
L
1.778 BSC
0.070 BSC
7.62 BSC
0.300 BSC
15.24 BSC
0.600 BSC
0.25 (0.010)
T A
M
S
0.25 (0.010)
T B
M
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
121
42
22
SEATING
PLANE
-T-
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