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参数资料
型号： MC7457TRX1000NC
厂商： Freescale Semiconductor
文件页数： 51/71页
文件大小： 0K
描述： IC MPU RISC 32BIT 483FCCBGA
标准包装： 36
系列： MPC74xx
处理器类型： 32-位 MPC74xx PowerPC
速度： 1.0GHz
电压： 1.1V
安装类型： 表面贴装
封装/外壳： 483-BCBGA，FCCBGA
供应商设备封装： 483-FCCBGA（29x29）
包装： 托盘
System Design Information
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
55
response time necessary. They should also be connected to the power and ground planes through two vias
to minimize inductance. Suggested bulk capacitors: 100–330 F (AVX TPS tantalum or Sanyo OSCON).
9.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OVDD. Unused active high inputs should be connected
to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, OVDD, GVDD, and GND pins in the
MPC7457. If the L3 interface is not used, GVDD should be connected to the OVDD power plane, and
L3VSEL should be connected to BVSEL; the remainder of the L3 interface may be left unterminated.
9.5
Output Buffer DC Impedance
The MPC7457 processor bus and L3 I/O drivers are characterized over process, voltage, and temperature.
To measure Z0, an external resistor is connected from the chip pad to OVDD or GND. Then, the value of
each resistor is varied until the pad voltage is OVDD/2 (see Figure 25).
The output impedance is the average of two components, the resistances of the pull-up and pull-down
devices. When data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the voltage at the
pad equals OVDD/2. RN then becomes the resistance of the pull-down devices. When data is held high,
SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals OVDD/2. RP then
becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value.
Then, Z0 = (RP + RN)/2.
Figure 25. Driver Impedance Measurement
Table 21 summarizes the signal impedance results. The impedance increases with junction temperature
and is relatively unaffected by bus voltage.
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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MC7457TRX1267LC 制造商:Freescale Semiconductor 功能描述:MPC74XX RISC 32-BIT 0.13UM 1.267GHZ 1.5V/1.8V/2.5V 483-PIN F - Trays
MC7457VG1000LC 功能描述:微处理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MC7457VG1000NC 功能描述:微处理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MC7457VG1267LC 功能描述:微处理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MC7457VG733NC 功能描述:IC MPU RISC 733MHZ 483FCCBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘
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