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参数资料
| 型号： | MC74HC1G02DTT3 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 门电路 |
| 英文描述： | HC/UH SERIES, 2-INPUT NOR GATE, PDSO5 |
| 封装： | SC-59, SOT-23, TSOP-5 |
| 文件页数： | 5/12页 |
| 文件大小： | 122K |
| 代理商： | MC74HC1G02DTT3 |
MC74HC1G02
http://onsemi.com
2
MAXIMUM RATINGS (Note 1.)
Symbol
Characteristics
Value
Unit
VCC
DC Supply Voltage
–0.5 to +7.0
V
VIN
DC Input Voltage
–0.5 to VCC + 0.5
V
VOUT
DC Output Voltage
–0.5 to VCC + 0.5
V
IIK
Input Diode Current
±20
mA
IOK
Output Diode Current
VOUT < GND; VOUT > VCC
±20
mA
IOUT
DC Output Current, per Pin
±12.5
mA
ICC
DC Supply Current, VCC and GND
±25
mA
PD
Power dissipation in still air
SC–88A, TSOP5
200
mW
qJA
Thermal Resistance
SC–88A, TSOP5 Package
333
_C/W
TL
Lead temperature, 1 mm from case for 10 s
260
°C
TJ
Junction temperature under bias
+150
°C
Tstg
Storage temperature
–65 to +150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 2.)
Machine Model (Note 3.)
Charged Device Model (Note 4.)
> 2000
> 200
N/A
V
ILatch–Up
Latch–Up Performance
Above VCC and Below GND at 125°C (Note 5.)
±500
mA
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
2. Tested to EIA/JESD22–A114–A
3. Tested to EIA/JESD22–A115–A
4. Tested to JESD22–C101–A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
DC Supply Voltage
2.0
6.0
V
VIN
DC Input Voltage
0.0
VCC
V
VOUT
DC Output Voltage
0.0
VCC
V
TA
Operating Temperature Range
–55
+125
°C
tr , tf
Input Rise and Fall Time
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
0
1000
600
500
400
ns
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature
°C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
10
100
1000
TIME, YEARS
NORMALIZED
F
AILURE
RA
TE
T J
=80
C°
T J
=90
C°
T J
=100
C°
T J
=1
10
C°
T J
=130
C°
T J
=120
C°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time
Junction Temperature
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