参数资料
型号: MC74HC367ADTR2G
厂商: ON Semiconductor
文件页数: 6/7页
文件大小: 0K
描述: IC BUFFER 3ST HEX 16-TSSOP
标准包装: 2,500
系列: 74HC
逻辑类型: 缓冲器/线路驱动器,非反相
元件数: 2
每个元件的位元数: 2,4(六路)
输出电流高,低: 7.8mA,7.8mA
电源电压: 2 V ~ 6 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 带卷 (TR)
MC74HC367A
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP16
DT SUFFIX
CASE 948F01
ISSUE B
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
4.90
5.10
0.193
0.200
B
4.30
4.50
0.169
0.177
C
1.20
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.18
0.28
0.007
0.011
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0
8
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
___
_
SECTION NN
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X
L/2
U
S
U
0.15 (0.006) T
S
U
0.15 (0.006) T
S
U
M
0.10 (0.004)
V S
T
0.10 (0.004)
T
V
W
0.25 (0.010)
16X
REF
K
N
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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