参数资料
| 型号： | MC74VHC1G00DTT1G |
| 厂商： | ON Semiconductor |
| 文件页数： | 6/6页 |
| 文件大小： | 0K |
| 描述： | IC GATE NAND SGL 2INP 5TSOP |
| 标准包装： | 1 |
| 系列： | 74VHC |
| 逻辑类型： | 与非门 |
| 电路数： | 1 |
| 输入数： | 2 |
| 电源电压： | 2 V ~ 5.5 V |
| 电流 - 静态（最大值）： | 1µA |
| 输出电流高，低： | 8mA，8mA |
| 逻辑电平 - 低： | 0.5 V ~ 1.65 V |
| 逻辑电平 - 高： | 1.5 V ~ 3.85 V |
| 额定电压和最大 CL 时的最大传播延迟： | 7.5ns @ 5V，50pF |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 5-TSOP |
| 封装/外壳： | 6-TSOP（0.059"，1.50mm 宽）5 引线 |
| 包装： | 标准包装 |
| 其它名称： | MC74VHC1G00DTT1GOSDKR |
MC74VHC1G00
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM
MIN
MAX
MILLIMETERS
A
3.00 BSC
B
1.50 BSC
C
0.90
1.10
D
0.25
0.50
G
0.95 BSC
H
0.01
0.10
J
0.10
0.26
K
0.20
0.60
M
0
10
S
2.50
3.00
12
3
54
S
A
G
B
D
H
C
J
__
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
C AB
T
0.10
2X
T
0.20
NOTE 5
C SEATING
PLANE
0.05
K
M
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
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particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC74VHC1G00TT1G | 制造商:ON Semiconductor 功能描述: |
| MC74VHC1G01DFT1 | 功能描述:逻辑门 2-5.5V Single NAND RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DFT1G | 功能描述:逻辑门 2-5.5V Single NAND 2-Input w/Open Drain RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DFT2 | 功能描述:逻辑门 2-5.5V Single NAND RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DFT2G | 功能描述:逻辑门 2-5.5V Single NAND 2-Input w/Open Drain RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
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