参数资料
型号: MC8641DHX1250HE
厂商: Freescale Semiconductor
文件页数: 14/130页
文件大小: 0K
描述: IC DUAL CORE PROCESSOR 1023-CBGA
标准包装: 1
系列: MPC86xx
处理器类型: 32-位 MPC86xx PowerPC
速度: 1.25GHz
电压: 1.05V
安装类型: 表面贴装
封装/外壳: 1023-BCBGA,FCCBGA
供应商设备封装: 1023-FCCBGA(33x33)
包装: 托盘
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
110
Freescale Semiconductor
Thermal
Figure 59. FC-CBGA Package Exploded Cross-Sectional View with Several Heat Sink Options
There are several commercially-available heat sinks for the MPC8641 provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions
781-769-2800
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions
888-732-6100
60 Alhambra Road, Suite 1
Warwick, RI 02886
Internet: www.calgreg.com
International Electronic Research Corporation (IERC)818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Thermal
Heat Sink
HCTE FC-CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
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