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参数资料
| 型号： | MC9S08MM64VLH64 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 8-BIT, FLASH, 48 MHz, MICROCONTROLLER, PQFP64 |
| 封装： | 10 X 10 MM, ROHS COMPLIANT, LQFP-64 |
| 文件页数： | 15/52页 |
| 文件大小： | 548K |
| 代理商： | MC9S08MM64VLH64 |
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Electrical Characteristics
Freescale Semiconductor
22
8
S3IDD
Stop3 mode
supply
current4
No clocks active
N/A
3
0.55
0.9
A
–40 to
25
P
N/A
3
5.5
8.9
A
70
C
N/A
3
14
18
A
85
C
N/A
3
37
42
A
105
P
N/A
20.35
0.5
A
–40 to
25
C
N/A
2
3.8
6.8
A
70
C
N/A
2
14
20
A
85
C
N/A
2
25
46
A
105
C
1 Data in Typical column was characterized at 3.0 V, 25°C or is typical recommended value.
2 ON = System Clock Gating Control registers turn on system clock to the corresponding modules.
3 OFF = System Clock Gating Control registers turn off system clock to the corresponding modules.
4 All digital pins must be configured to a known state to prevent floating pins from adding current. Smaller packages
may have some pins that are not bonded out; however, software must still be configured to the largest pin package
available so that all pins are in a known state. Otherwise, floating pins that are not bonded in the smaller packages
may result in a higher current draw.
NOTE: I/O pins are configured to output low, input-only pins are configured to pullup enabled. IRO pin connects to
ground. TRIAMPx, OPAMPx, DACO, and VREFO pins are at reset state and unconnected.
Table 11. Typical Stop Mode Adders
#
Parameter
Condition
Temperature (°C)
Units
C
–40
25
70
85
105
1
LPO
—
50
75
100
150
250
nA
D
2
EREFSTEN
RANGE = HGO = 0
600
650
750
850
1000
nA
D
3IREFSTEN1
—
73
80
92
125
A
T
4
TOD
Does not include clock source
current
50
75
100
150
250
nA
D
5
PRACMP1
Not using the bandgap
(BGBE = 0)
30
35
40
55
75
A
T
6
ADC1
ADLPC = ADLSMP = 1
Not using the bandgap
(BGBE = 0)
190
195
210
220
260
A
T
Table 10. Supply Current Characteristics (Continued)
#
Symbol
Parameter
Bus
Freq
VDD (V)
Typ1
Max
Unit
Temp
(
C)
C
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
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