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参数资料
| 型号： | MC9S08MM64VLH |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 7/52页 |
| 文件大小： | 0K |
| 描述： | IC MCU 8BIT 32K FLASH 64LQFP |
| 标准包装： | 160 |
| 系列： | S08 |
| 核心处理器： | S08 |
| 芯体尺寸： | 8-位 |
| 速度： | 48MHz |
| 连通性： | I²C，SCI，SPI，USB |
| 外围设备： | LVD，POR，PWM，WDT |
| 输入/输出数： | 33 |
| 程序存储器容量： | 64KB（64K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 12K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.8 V ~ 3.6 V |
| 数据转换器： | A/D 6x16b，D/A 1x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 64-LQFP |
| 包装： | 托盘 |
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Electrical Characteristics
Freescale Semiconductor
15
2.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than
being controlled by the MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current
(heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
Table 6. Thermal Characteristics
#
Symbol
Rating
Value
Unit
1TA
Operating temperature range (packaged):
C
MC9S08MM128
–40 to 105
MC9S08MM64
–40 to 105
MC9S08MM32
–40 to 105
MC9S08MM32A
–40 to 105
2TJMAX
Maximum junction temperature
135
C
3
JA
Thermal resistance1,2,3,4 Single-layer board — 1s
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
2 Junction to Ambient Natural Convection
3 1s — Single layer board, one signal layer
4 2s2p — Four layer board, 2 signal and 2 power layers
C/W
81-pin MBGA
77
80-pin LQFP
55
64-pin LQFP
68
4
JA
Thermal resistance1, 2, 3, 4 Four-layer board — 2s2p
C/W
81-pin MBGA
47
80-pin LQFP
40
64-pin LQFP
49
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC9S08MM64VLK | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Advanced Information |
| MC9S08MM64VMB | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Advanced Information |
| MC9S08MP12 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| MC9S08MP12E2MLC | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| MC9S08MP12E2MLF | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
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