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参数资料
| 型号： | MC9S08MP12VWL |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 2/36页 |
| 文件大小： | 0K |
| 描述： | MCU 8BIT .25U SGF FLASH SOIC |
| 标准包装： | 26 |
| 系列： | S08 |
| 核心处理器： | S08 |
| 芯体尺寸： | 8-位 |
| 速度： | 51.34MHz |
| 连通性： | I²C，LIN，SCI，SPI |
| 外围设备： | LVD，POR，PWM，WDT |
| 输入/输出数： | 22 |
| 程序存储器容量： | 12KB（12K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 512 x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 数据转换器： | A/D 13x12b，D/A 3x5b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 包装： | 管件 |
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MC9S08MP16 Series Data Sheet, Rev. 2
Electrical Characteristics
Freescale Semiconductor
10
2.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K (TJ + 273C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD (TA + 273C) + JA (PD)
2
Eqn. 3
Table 4. Thermal Characteristics
Num
C
Rating
Symbol
Consumer &
Industrial
Automotive
Unit
1
—
Operating temperature range (packaged)
TA
–40 to 105
–40 to 125
C
2
D
Maximum junction temperature
TJ
115
135
C
3
D
Thermal resistance 1,2
single-layer board
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Junction-to-ambient natural convection
48-pin LQFP
JA
80
C/W
32-pin LQFP
85
—
28-pin SOIC
71
—
4
D
Thermal resistance 1,2
four-layer board
48-pin LQFP
JA
56
C/W
32-pin LQFP
57
—
28-pin SOIC
48
—
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC9S08MP16 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| MC9S08MP16E2MLC | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| MC9S08MP16E2MLF | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| MC9S08MP16E2MWL | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
| MC9S08MP16E2VLC | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit HCS08 Central Processor Unit (CPU) |
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