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参数资料
型号： MC9S12C32CPB25
厂商： MOTOROLA INC
元件分类： 微控制器/微处理器
英文描述： 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP52
封装： LQFP-52
文件页数： 8/136页
文件大小： 2022K
代理商： MC9S12C32CPB25
Device User Guide — 9S12C128DGV1/D V01.05
105
B.5 NVM, Flash and EEPROM
B.5.1 NVM timing
The time base for all NVM program or erase operations is derived from the oscillator. A minimum
oscillator frequency fNVMOSC is required for performing program or erase operations. The NVM modules
do not have any means to monitor the frequency and will not prevent program or erase operation at
frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at
a lower frequency a full program or erase transition is not assured.
The Flash program and erase operations are timed using a clock derived from the oscillator using the
FCLKDIV and ECLKDIV registers respectively. The frequency of this clock must be set within the limits
specified as fNVMOP.
The minimum program and erase times shown in Table B-8 are calculated for maximum fNVMOP and
maximum fbus. The maximum times are calculated for minimum fNVMOP and a fbus of 2MHz.
B.5.1.1 Single Word Programming
The programming time for single word programming is dependant on the bus frequency as a well as on
the frequency f¨NVMOP and can be calculated according to the following formula.
B.5.1.2 Row Programming
Generally the time to program a consecutive word can be calculated as:
For the C16, GC16, C32 and GC32 device flash arrays, where up to 32 words in a row can be programmed
consecutively by keeping the command pipeline filled, the time to program a whole row is:
For the C64, GC64, C96, C128 and GC128 device flash arrays, where up to 64 words in a row can be
programmed consecutively by keeping the command pipeline filled, the time to program a whole row is:
Row programming is more than 2 times faster than single word programming.
t
swpgm
9
1
f
NVMOP
---------------------
25
1
f
bus
----------
+
=
t
bwpgm
4
1
f
NVMOP
---------------------
9
1
f
bus
----------
+
=
t
brpgm
t
swpgm
31 t
bwpgm
+
=
t
brpgm
t
swpgm
63 t
bwpgm
+
=
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相关代理商/技术参数
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MC9S12C32CPBE25 功能描述:16位微控制器 - MCU GOLDFISH RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12C32MFA25 制造商:Freescale Semiconductor 功能描述:MCU 16BIT HCS12 CISC 32KB FLASH 2.5V/5V 48LQFP - Trays
MC9S12C32MFAE16 功能描述:16位微控制器 - MCU GOLDFISH RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12C32MFAE25 功能描述:16位微控制器 - MCU GOLDFISH RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12C32MFU25 功能描述:IC MCU 32K FLASH 25MHZ 80-QFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:HCS12 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN，SCI，SPI 外围设备:POR，PWM，温度传感器，WDT 输入/输出数:21 程序存储器容量:40KB（20K x 16） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
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