参数资料
型号: MCF51JE256VML
厂商: Freescale Semiconductor
文件页数: 9/47页
文件大小: 0K
描述: IC MCU 256K COLDF 104-PBGA
标准包装: 240
系列: MCF51JE
核心处理器: Coldfire V1
芯体尺寸: 32-位
速度: 50MHz
连通性: CAN,EBI/EMI,I²C,SCI,SPI,USB OTG
外围设备: LVD,PWM,WDT
输入/输出数: 69
程序存储器容量: 256KB(256K x 8)
程序存储器类型: 闪存
RAM 容量: 32K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 3.6 V
数据转换器: A/D 12x12b,D/A 1x12b
振荡器型: 外部
工作温度: -40°C ~ 105°C
封装/外壳: 104-LFBGA
包装: 管件
Preliminary Electrical Characteristics
MCF51JE256 Datasheet, Rev. 4
Freescale Semiconductor
17
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K (TJ + 273C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD (TA + 273C) + JA (PD)
2
Eqn. 3
Table 6. Thermal Characteristics
#
Symbol
Rating
Value
Unit
1
TA
Operating temperature range (packaged):
C
MCF51JE256
–40 to 105
MCF51JE128
–40 to 105
2
TJMAX
Maximum junction temperature
135
C
3
JA
Thermal resistance1,2,3,4 Single-layer board — 1s
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2
Junction to Ambient Natural Convection
3
1s — Single layer board, one signal layer
4
2s2p — Four layer board, 2 signal and 2 power layers
C/W
104-pin MBGA
67
100-pin LQFP
53
81-pin MBGA
67
80-pin LQFP
53
4
JA
Thermal resistance1, 2, 3, 4 Four-layer board — 2s2p
C/W
104-pin MBGA
39
100-pin LQFP
41
81-pin MBGA
39
80-pin LQFP
39
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