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| 型号： | MCF52223CVM66J |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 24/55页 |
| 文件大小： | 0K |
| 描述： | IC MCU 32BIT W/USB 81MAPBGA |
| 标准包装： | 240 |
| 系列： | MCF5222x |
| 核心处理器： | Coldfire V2 |
| 芯体尺寸： | 32-位 |
| 速度： | 66MHz |
| 连通性： | I²C，SPI，UART/USART，USB OTG |
| 外围设备： | DMA，LVD，POR，PWM，WDT |
| 输入/输出数： | 56 |
| 程序存储器容量： | 256KB（256K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 32K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 3 V ~ 3.6 V |
| 数据转换器： | A/D 8x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 81-LBGA |
| 包装： | 托盘 |
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Electrical Characteristics
MCF52223 ColdFire Microcontroller, Rev. 3
Freescale Semiconductor
30
2.3
Thermal Characteristics
Table 24 lists thermal resistance values.
Table 24. Thermal Characteristics
Characteristic
Symbol
Value
Unit
100 LQFP
Junction to ambient, natural convection
Single layer board (1s)
JA
531,2
1
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
391,3
3 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
421,3
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
331,3
C/W
Junction to board
—
JB
254
4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
C/W
Junction to case
—
JC
95
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
—
Tj
105
oC
81 MAPBGA Junction to ambient, natural convection
Single layer board (1s)
JA
611,2
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
352,3
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
502,3
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
312,3
C/W
Junction to board
—
JB
204
C/W
Junction to case
—
JC
125
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
—
Tj
105
oC
64 LQFP
Junction to ambient, natural convection
Single layer board (1s)
JA
621,2
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
431,3
C/W
Junction to ambient (@200 ft/min)
Single layer board (1s)
JMA
501,3
C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
JMA
361,3
C/W
Junction to board
—
JB
264
C/W
Junction to case
—
JC
95
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
—
Tj
105
oC
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