参数资料
型号: MCF52233CVM60
厂商: Freescale Semiconductor
文件页数: 25/55页
文件大小: 0K
描述: IC MCU 32BIT 60MHZ 121MAPBGA
标准包装: 189
系列: MCF5223x
核心处理器: Coldfire V2
芯体尺寸: 32-位
速度: 60MHz
连通性: 以太网,I²C,SPI,UART/USART
外围设备: DMA,LVD,POR,PWM,WDT
输入/输出数: 73
程序存储器容量: 256KB(256K x 8)
程序存储器类型: 闪存
RAM 容量: 32K x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 3.6 V
数据转换器: A/D 8x12b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 121-LBGA
包装: 托盘
Electrical Characteristics
MCF52235 ColdFire Microcontroller Data Sheet, Rev. 10
Freescale Semiconductor
31
The average chip-junction temperature (TJ) in C can be obtained from
Eqn. 1
where
TA = ambient temperature, C
JMA = package thermal resistance, junction-to-ambient, C/W
PD =PINT + PI/O
PINT = chip internal power, IDD VDD, watts
PI/O = power dissipation on input and output pins — user determined
For most applications, PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
2.2
ESD Protection
Table 21. ESD Protection Characteristics1
1 A device is defined as a failure if the device no longer meets the device specification requirements after
exposure to ESD pulses. Complete DC parametric and functional testing is performed per applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Characteristic
Symbol
Value
Units
ESD target for Human Body Model
HBM
1500 (ADC and EPHY pins)
2000 (All other pins)
V
ESD target for Charged Device Model
CDM
250
V
HBM circuit description
Rseries
1500
ohms
C100
pF
Number of pulses per pin (HBM)
positive pulses
negative pulses
1
Number of pulses per pin (CDM)
positive pulses
negative pulses
3
Interval of pulses (HBM)
1.0
sec
Interval of pulses (CDM)
0.2
sec
TJ
TA
PD JMA
+
=
PD
KTJ 273C
+
=
KPD
TA 273C
+
JMA
PD
2
+
=
相关PDF资料
PDF描述
VI-24B-CU-S CONVERTER MOD DC/DC 95V 200W
VI-244-CU-S CONVERTER MOD DC/DC 48V 200W
VI-213-CU-S CONVERTER MOD DC/DC 24V 200W
VE-BTX-IX-B1 CONVERTER MOD DC/DC 5.2V 75W
VE-BTW-IX-B1 CONVERTER MOD DC/DC 5.5V 75W
相关代理商/技术参数
参数描述
MCF52233CVM60J 功能描述:32位微控制器 - MCU MCU 32-Bit RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
MCF52234 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire Microcontroller
MCF52234CAL60 功能描述:32位微控制器 - MCU KIRIN2E EPP RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
MCF52234CVM60 功能描述:32位微控制器 - MCU KIRIN2E 121 MAPBGA EPP RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
MCF52234CVM60J 功能描述:32位微控制器 - MCU MCU 32-Bit RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT