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参数资料
| 型号： | MCF5274VM166 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | ROHS COMPLIANT, PLASTIC, MAPBGA-256 |
| 文件页数： | 38/44页 |
| 文件大小： | 980K |
| 代理商： | MCF5274VM166 |
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Documentation
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
Freescale Semiconductor
43
9
Documentation
Documentation regarding the MCF5275 and their development support tools is available from a local
Freescale distributor, a Freescale semiconductor sales office, the Freescale Literature Distribution Center,
or through the Freescale web address at http://www.freescale.com/coldfire.
10
Revision History
Table 29 provides a revision history for this hardware specification.
Table 29. Document Revision History
Rev. No.
Substantive Change(s)
0
Initial release.
1
Added Figure 6.
1.1
Removed duplicate information in the module description sections. The information is all in the Signals
Description Table.
1.2
Removed Overview, Features, Signal Descriptions, Modes of Operation, and Address Multiplexing sections. This
information can be found in the MCF5275 Reference Manual.
Removed list of documentation in Section 9, “Documentation.”. An up-to-date list is always available on our web
site.
Changed CLKOUT -> PSTCLK in Section 8.16, “Debug AC Timing Specifications.”
Table 13: Timings B6a, B6b, B6c, B7, B7a, B9, B12 updated:
B6a, B6b, B6c maximum changed from “0.5tCYC + 5” to “0.5tCYC +5.5”
B7, B7a minimum changed from “0.5tCYC + 1.5” to “0.5tCYC +1.0”
B9, B11 minimum changed from “1.5” to “1.0”
1.3
Added thermal characteristics for 196 MAPBGA in Table 8.
Updated package dimensions drawing, Figure 6.
2
Removed second sentence from Section 8.11.1, “MII Receive Signal Timing (FECn_RXD[3:0], FECn_RXDV,
FECn_TXEN, FECn_TXER, FECn_TXCLK),” regarding no minimum frequency requirement for TXCLK.
Removed third and fourth paragraphs from Section 8.11.2, “MII Transmit Signal Timing (FECn_TXD[3:0],
FECn_TXEN, FECn_TXER, FECn_TXCLK),” as this feature is not supported on this device.
3
Corrected Ordering Information, Table 6.
Figure 2: Moved PLLVDD from 1.5V to 3.3V supply line and corrected relevant text in sections below table.
4
Table 10, added PLL supply voltage row
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
M5275EVB,
MCF5274CVM166,
MCF5274LCVM166,
MCF5274LVM166,
MCF5274VM166,
MCF5275CVM166,
MCF5275LCVM166
相关PDF资料 |
PDF描述 |
|---|---|
| MCF5275LCVM133 | 32-BIT, 133 MHz, RISC PROCESSOR, PBGA196 |
| MCF5275CVM133 | 32-BIT, 133 MHz, RISC PROCESSOR, PBGA256 |
| MCF5274VM133 | 32-BIT, 133 MHz, RISC PROCESSOR, PBGA256 |
| MCF5280CVF80 | FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA256 |
| MCF5281CVM80 | FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA256 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF5274VM166J | 制造商:Freescale Semiconductor 功能描述:MCF5274 V2CORE 64KSRAM - Bulk |
| MCF5275 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Family Hardware Specification |
| MCF5275CVM133 | 功能描述:IC MCU 32BIT 133MHZ 256-MAPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MCF527x 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN，SCI，SPI 外围设备:POR，PWM，温度传感器，WDT 输入/输出数:21 程序存储器容量:40KB（20K x 16） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| MCF5275CVM166 | 功能描述:微处理器 - MPU MCF5275 V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MCF5275CVM166 | 制造商:Freescale Semiconductor 功能描述:Microprocessor IC |
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