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| 型号： | MCF5275CVM166 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | ROHS COMPLIANT, PLASTIC, MAPBGA-256 |
| 文件页数： | 2/44页 |
| 文件大小： | 980K |
| 代理商： | MCF5275CVM166 |
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MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
Design Recommendations
Freescale Semiconductor
10
5.2.1
Supply Voltage Sequencing and Separation Cautions
(PLLVDD), and Core VDD (VDD).
Figure 2. Supply Voltage Sequencing and Separation Cautions
The relationship between SDVDD and OVDD is non-critical during power-up and power-down sequences.
SDVDD (2.5V or 3.3V) and OVDD are specified relative to VDD.
5.2.1.1
Power Up Sequence
If OVDD/SDVDD are powered up with VDD at 0 V, then the sense circuits in the I/O pads cause all pad
output drivers connected to the OVDD/SDVDD to be in a high impedance state. There is no limit on how
long after OVDD/SDVDD powers up before VDD must powered up. VDD should not lead the OVDD,
SDVDD, or PLLVDD by more than 0.4 V during power ramp-up or high current will be in the internal ESD
protection diodes. The rise times on the power supplies should be slower than 1
μs to avoid turning on the
internal ESD protection clamp diodes.
The recommended power up sequence is as follows:
1. Use 1
μs or slower rise time for all supplies.
2. VDD/PLLVDD and OVDD/SDVDD should track up to 0.9 V, then separate for the completion of
ramps with OVDD/SD VDD going to the higher external voltages. One way to accomplish this is to
use a low drop-out voltage regulator.
SDVDD (2.5V)
Supplies Stable
2
1
3.3V
2.5V
1.5V
0
Time
Notes:
VDD should not exceed OVDD, SDVDD or PLLVDD by more than
0.4 V at any time, including power-up.
Recommended that VDD should track OVDD/SDVDD/PLLVDD up to
0.9 V, then separate for completion of ramps.
Input voltage must not be greater than the supply voltage (OVDD, SDVDD,
VDD, or PLLVDD) by more than 0.5 V at any time, including during power-up.
Use 1 ms or slower rise time for all supplies.
1.
2.
3.
4.
DC
P
o
w
e
rSupp
ly
V
o
ltage
VDD,
OVDD, SDVDD, PLLVDD
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
M5275EVB,
MCF5274CVM166,
MCF5274LCVM166,
MCF5274LVM166,
MCF5274VM166,
MCF5275CVM166,
MCF5275LCVM166
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF5275CVM166 | 制造商:Freescale Semiconductor 功能描述:Microprocessor IC |
| MCF5275CVM166J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF5275LCVM133 | 功能描述:IC MCU 32BIT 133MHZ 196-MAPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MCF527x 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN，SCI，SPI 外围设备:POR，PWM，温度传感器，WDT 输入/输出数:21 程序存储器容量:40KB（20K x 16） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| MCF5275LCVM166 | 功能描述:微处理器 - MPU MCF5275L V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MCF5275LCVM166J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
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