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参数资料
| 型号： | MCF5329CVM240J |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 9/50页 |
| 文件大小： | 0K |
| 描述： | IC MPU RISC 240MHZ 256MAPBGA |
| 标准包装： | 90 |
| 系列： | MCF532x |
| 核心处理器： | Coldfire V3 |
| 芯体尺寸： | 32-位 |
| 速度： | 240MHz |
| 连通性： | CAN，EBI/EMI，以太网，I²C，SPI，SSI，UART/USART，USB，USB OTG |
| 外围设备： | DMA，LCD，PWM，WDT |
| 输入/输出数： | 94 |
| 程序存储器类型： | ROMless |
| RAM 容量： | 32K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.4 V ~ 3.6 V |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 256-LBGA |
| 包装： | 托盘 |
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Electrical Characteristics
MCF532x ColdFire Microprocessor Data Sheet, Rev. 5
Freescale Semiconductor
17
5.2
Thermal Characteristics
The average chip-junction temperature (TJ) in °C can be obtained from:
Eqn. 1
Where:
TA
= Ambient Temperature,
°C
QJMA
= Package Thermal Resistance, Junction-to-Ambient,
°C/W
PD
=PINT + PI/O
PINT
=IDD × IVDD, Watts - Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
Table 5. Thermal Characteristics
Characteristic
Symbol
256MBGA
196MBGA
Unit
Junction to ambient, natural convection
Four layer board
(2s2p)
θ
JMA
371,2
1
θ
JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
Freescale recommends the use of
θ
JmA and power dissipation specifications in the system design to prevent
device junction temperatures from exceeding the rated specification. System designers should be aware that
device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in the
customer’s system using the
Ψ
jt parameter, the device power dissipation, and the method described in
EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-6 with the board horizontal.
°C/W
Junction to ambient (@200 ft/min)
Four layer board
(2s2p)
θ
JMA
341,2
°C/W
Junction to board
—
θ
JB
273
3 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
323
°C/W
Junction to case
—
θ
JC
164
4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
194
°C/W
Junction to top of package
—
Ψ
jt
41,5
5 Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written in conformance with Psi-JT.
°C/W
Maximum operating junction temperature
—
Tj
105
oC
T
J
T
A
P
D
Θ
JMA
×
()
+
=
P
D
K
T
J
273
°C
+
()
---------------------------------
=
KP
D
T
A
273
°C
×
() Q
JMA
P
D
2
×
+
×
=
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相关代理商/技术参数 |
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| MCF5329DS | 制造商:ANALOGICTECH 制造商全称:Advanced Analogic Technologies 功能描述:MCF5329 ColdFire Microprocessor Data Sheet |
| MCF5372 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor |
| MCF53721 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor |
| MCF53721CVM240 | 功能描述:微处理器 - MPU MCF5329 DRAGONFIRE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MCF5372CAB180 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microprocessor Data Sheet |
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