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型号： MCIMX257CJN4A
厂商： Freescale Semiconductor
文件页数： 60/153页
文件大小： 0K
描述： IC MPU I.MX25 AUTO 347MAPBGA
标准包装： 189
系列： i.MX25
核心处理器： ARM9
芯体尺寸： 32-位
速度： 400MHz
连通性： 1 线，CAN，EBI/EMI，以太网，I²C，MMC，智能卡，SPI，SSI，UART/USART，USB OTG
外围设备： DMA，I²S，LCD，POR，PWM，WDT
输入/输出数： 128
程序存储器类型： 外部程序存储器
RAM 容量： 144K x 8
电压 - 电源 (Vcc/Vdd)： 1.15 V ~ 1.52 V
数据转换器： A/D 3x12b
振荡器型： 外部
工作温度： -40°C ~ 85°C
封装/外壳： 347-LFBGA
包装： 托盘
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
152
Freescale Semiconductor
Rev. 7
12/2010
Updated the first paragraph of Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Updated Table 4, "Signal Considerations," on page 9 for NVCC_DRYICE signal.
Updated the third note for Table 6, "DC Operating Conditions," on page 11.
Added Table 9, "Recommended External Crystal Specifications," on page 13.
Added Table 10, "Recommended External Reference Clock Specifications," on page 13.
Added a note for the line NVCC_DRYICE in Table 100, "17
×17 mm Package Ground, Power Sense, and
Reference Contact Assignments," on page 125.
Updated Table 101, "17×17 mm Package i.MX25 Signal Contact Assignment," on page 127.
Added a note for the line NVCC_DRYICE in Table 104, "12x12 mm Package Ground, Power Sense, and
Reference Contact Assignments," on page 139.
Removed records for UPLL_BYPCLK, USBPHY2_DP, USBPHY1RREF, USBPHY1_DM,
USBPHY1_DP, USBPHY1_UID, USBPHY1_VBUS, and USBPHY2_DM contacts from Table 104,
"12x12 mm Package Ground, Power Sense, and Reference Contact Assignments," on page 139.
Updated Table 105, "12x12 mm Package i.MX25 Signal Contact Assignment," on page 140.
Rev. 6
09/2010
Added Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Rev. 5
08/2010
Updated Table 56, "WEIM Bus Timing Parameters," on page 69 to include new row for WE19.
Updated Table 6, "DC Operating Conditions," on page 11 to include Min and Max values of FUSE_VDD.
Rev. 4
06/2010
Updated Table 1, “Ordering Information,” to include new part numbers.
Rev. 3
03/2010
Updated Table 1, “Ordering Information,” to include new part numbers.
Added Table 2, “i.MX25 Parts Functional Differences.”
Added Section 3.3, “Power Characteristics.”
Added Section 4.5, “347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch.”
Added Section 4.6, “Ground, Power, Sense, and Reference Contact Assignments Case 12x12 mm, 0.5
mm Pitch.”
Added Section 4.7, “Signal Contact Assignments—12 x 12 mm, 0.5 mm Pitch.
Added Section 4.8, “i.MX25 12x12 Package Ball Map.”
Rev. 2
12/2009
Updated Table 1, “Ordering Information,” to include new part numbers.
Rev. 1
10/2009
Updated Table 1, “Ordering Information,” to include new part numbers.
Updated DRYICE description in Table 3, “i.MX25 Digital and Analog Modules.”
Updated REF signal description in Table 4, “Signal Considerations.”
Updated ESD damage immunity values in Table 5, “DC Absolute Maximum Ratings.”
Updated values in Table 13, “i.MX25 Power Mode Current Consumption.”
Added a note on timing in Section 3.2.1, “Power-Up Sequence.”
Added Table 14, “iMX25 Reduced Power Mode Current Consumption.”
Updated Table 55, “NFC Timing Parameters.”
Updated values in Table 56, “WEIM Bus Timing Parameters.
Updated Table 85, “Touchscreen ADC Electrical Specifications.”
Rev. 0
6/2009
Initial release.
Table 108. Revision History (continued)
Rev.
Number
Date
Substantive Change(s)
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