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| 型号： | MCP1404T-E/SO |
| 厂商： | Microchip Technology |
| 文件页数： | 9/22页 |
| 文件大小： | 0K |
| 描述： | IC MOSFET DVR 4.5A DUAL 16SOIC |
| 标准包装： | 1,000 |
| 配置： | 低端 |
| 输入类型： | 非反相 |
| 延迟时间： | 40ns |
| 电流 - 峰： | 4.5A |
| 配置数： | 2 |
| 输出数： | 2 |
| 电源电压： | 4.5 V ~ 18 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 带卷 (TR) |
MCP1403/4/5
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1 .
TABLE 3-1:
PIN FUNCTION TABLE (1)
8-Pin
PDIP
SOIC
1
2
—
3
—
—
4
—
—
5
—
6
—
7
—
8
—
8-Pin
DFN
1
2
—
3
—
—
4
—
—
5
—
6
—
7
—
8
PAD
16-Pin
SOIC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
—
Symbol
NC
IN A
NC
GND
GND
NC
IN B
NC
NC
OUT B
OUT B
V DD
V DD
OUT A
OUT A
NC
NC
No Connection
Control Input for Output A
No Connection
Ground
Ground
No Connection
Control Input for Output B
No Connection
No Connection
Output B
Output B
Supply Input
Supply Input
Output A
Output A
No Connection
Exposed Metal Pad
Description
Note 1:
Duplicate pins must be connected for proper operation.
3.1
Supply Input (V DD )
3.4
Outputs A and B
V DD is the bias supply input for the MOSFET driver and
has a voltage range of 4.5V to 18V. This input must be
decoupled to ground with a local capacitor. This bypass
capacitor provides a localized low-impedance path for
the peak currents that are to be provided to the load.
3.2 Control Inputs A and B
The MOSFET driver input is a high-impedance, TTL/
CMOS-compatible input. The input also has hysteresis
between the high and low input levels, allowing them to
be driven from slow rising and falling signals, and to
provide noise immunity.
Outputs A and B are CMOS push-pull output that is
capable of sourcing and sinking 4.5A of peak current
(V DD = 18V). The low output impedance ensures the
gate of the external MOSFET will stay in the intended
state even during large transients. These output also
has a reverse current latch-up rating of 1.5A.
3.5 Exposed Metal Pad
The exposed metal pad of the DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board to aid in heat
removal from the package.
3.3
Ground (GND)
Ground is the device return pin. The ground pin should
have a low impedance connection to the bias supply
source return. High peak currents will flow out the
ground pin when the capacitive load is being
discharged.
? 2007 Microchip Technology Inc.
DS22022B-page 9
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