参数资料
型号: MCP1406T-E/SN
厂商: Microchip Technology
文件页数: 12/28页
文件大小: 0K
描述: IC MOSFET DRIVER 6A HS 8SOIC
标准包装: 3,300
配置: 低端
输入类型: 反相
延迟时间: 40ns
电流 - 峰: 6A
配置数: 1
输出数: 1
电源电压: 4.5 V ~ 18 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
其它名称: MCP1406T-E/SNTR
MCP1406/07
4.4
PCB Layout Considerations
4.5.2
QUIESCENT POWER DISSIPATION
Proper PCB layout is important in a high current, fast
switching circuit to provide proper device operation and
robustness of design. PCB trace loop area and induc-
tance should be minimized by the use of a ground
plane or ground trace located under the MOSFET gate
drive signals, separate analog and power grounds, and
local driver decoupling.
The MCP1406/07 devices have two pins each for V DD ,
OUTPUT, and GND. Both pins must be used for proper
operation. This also lowers path inductance which will,
along with proper decoupling, help minimize ringing in
the circuit.
Placing a ground plane beneath the MCP1406/07 will
help as a radiated noise shield as well as providing
some heat sinking for power dissipated within the
device.
The power dissipation associated with the quiescent
current draw depends upon the state of the input pin.
The MCP1406/07 devices have a quiescent current
draw when the input is high of 0.13 mA (typ) and
0.035 mA (typ) when the input is low. The quiescent
power dissipation is:
P Q = ? I QH ? D + I QL ? ? 1 – D ? ? ? V DD
Where:
I QH = Quiescent current in the high state
D = Duty cycle
I QL = Quiescent current in the low state
V DD = MOSFET driver supply voltage
4.5
Power Dissipation
4.5.3 OPERATING POWER DISSIPATION
The operating power dissipation occurs each time the
The total internal power dissipation in a MOSFET driver
is the summation of three separate power dissipation
elements.
P T = P L + P Q + P CC
Where:
P T = Total power dissipation
P L = Load power dissipation
P Q = Quiescent power dissipation
P CC = Operating power dissipation
MOSFET driver output transitions; because, for a very
short period of time both MOSFETs in the output stage
are on simultaneously. This cross-conduction current
leads to a power dissipation, as described by the
following equation:
P CC = CC ? f ? V DD
Where:
CC = Cross-conduction constant (A*sec)
f = Switching frequency
V DD = MOSFET driver supply voltage
4.5.1
CAPACITIVE LOAD DISSIPATION
The power dissipation caused by a capacitive load is a
direct function of frequency, total capacitive load, and
supply voltage. The power lost in the MOSFET driver
for a complete charging and discharging cycle of a
MOSFET is:
P L = f ? C T ? V DD
2
Where:
f = Switching frequency
C T = Total load capacitance
V DD = MOSFET driver supply voltage
DS22019B-page 12
? 2006-2012 Microchip Technology Inc.
相关PDF资料
PDF描述
MCP1407T-E/SN IC MOSFET DRIVER 6A HS 8SOIC
EEC22DREH-S13 CONN EDGECARD 44POS .100 EXTEND
TC1413NEPA IC MOSFET DVR 3A HS 8DIP
RBC06DRYI CONN EDGECARD 12POS DIP .100 SLD
TC4426VMF IC MOSFET DVR 1.5A DUAL HS 8DFN
相关代理商/技术参数
参数描述
MCP1407 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:6A High-Speed Power MOSFET Drivers
MCP1407-E/AT 功能描述:功率驱动器IC 6A Sngl MOSFET Drvr RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
MCP1407-E/MF 功能描述:功率驱动器IC 6A Sngl MOSFET Drvr RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
MCP1407-E/P 功能描述:功率驱动器IC 4.5A Dual MOSFET RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
MCP1407-E/PA 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:6A High-Speed Power MOSFET Drivers