参数资料
型号: MCP1601EV
厂商: Microchip Technology
文件页数: 15/22页
文件大小: 0K
描述: BOARD EVALUATION FOR MCP1601
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 1.8V,2.05V,2.45V ~ 3.28V
电流 - 输出: 500mA
输入电压: 2.7 ~ 5.5 V
稳压器拓扑结构: 降压
频率 - 开关: 750kHz
板类型: 完全填充
已供物品:
已用 IC / 零件: MCP1601
产品目录页面: 664 (CN2011-ZH PDF)
相关产品: MCP1601-I/MS-ND - IC REG BUCK SYNC ADJ 0.5A 8MSOP
MCP1601T-I/MS-ND - IC REG BUCK SYNC ADJ 0.5A 8MSOP
MCP1601
TABLE 5-4:
INDUCTOR SUPPLIERS
Supplier
Sumida ?
Sumida ?
Sumida ?
CT*
L
10 μH
10 μH
10 μH
10 μH
Type
Unshielded
Shielded
Shielded
Shielded
Area (mm)
4.1 mm x 3.8 mm
4.0 mm x 4.0 mm
5.7 mm x 5.7 mm
7.3 mm x 7.3 mm
Height
(mm)
3.0 mm
1.8 mm
3.0 mm
3.5 mm
DC
Resistance
230 M ?
160 M ?
65 M ?
70 M ?
Max.
Current
0.76A
0.66A
1.3A
1.7A
Series
C32
CDRH3D16
CDRH5D28
CTCDRH73
Coilcraft
?
10 μH
Shielded
6.6 mm x 4.5 mm
3.0 mm
75 M ?
1.0A
DS1608
Coilcraft ?
15 μH
Shielded
6.6 mm x 4.5 mm
3.0 mm
90 M ?
0.8A
DS1608
Coilcraft
?
22 μH
Shielded
6.6 mm x 4.5 mm
3.0 mm
110 M ?
0.7A
DS1608
Coilcraft ?
10 μH
Unshielded
6.0 mm x 5.4 mm
1.3 mm
300 M ?
0.60A
LPO6013
Wafer
Coilcraft ?
15 μH
Unshielded
6.0 mm x 5.4 mm
1.3 mm
380 M ?
0.55A
LPO6013
Wafer
Taiyo
10 μH
Shielded
5.0 mm x 5.0 mm
2.0 mm
66 M ?
0.7A
NP04SB100M
Yuden ?
Note:
CT* = Central Technologies
5.5
Efficiency
5.6
Printed Circuit Board Layout
Efficiency will be affected by the external component
selection and the specific operating conditions for the
application. In Section 2.0, “ Typical Performance
Curves ” , there are curves plotted using typical induc-
tors that can be used to estimate the converter
efficiency for 1.2V, 1.8V and 3.3V.
The MCP1601 is capable of switching over 500 mA at
750 kHz. As with all high-frequency, switch mode,
power supplies, a good board layout is essential to pre-
venting the noise generated by the power train switch-
ing from interfering with the sensing circuitry. The
MCP1601 has not demonstrated a sensitivity to layout,
but good design practice will prevent undesired results.
MCP1601
C IN
C OUT
P GND
A GND
C 1
R 2
P GND
R 1
SILK
FIGURE 5-2:
A GND
Component Placement.
When designing a board layout for the MCP1601, the
first thing to consider is the physical placement of the
external components. In Figure 5-2, SM0805 10 μF
ceramic capacitors are used for C IN and C OUT . The
SM0603 package is used for R 1 , R 2 and C 1 . The induc-
tor used is the Coilcraft ? LPO2506 series low profile
(0.047 ” high). The board outline in this example is 1 ” x
1 ” . C IN , L and C OUT are positioned around the
MCP1601 to make the high current paths as short as
possible.
? 2003 Microchip Technology Inc.
DS21762A-page 15
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