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参数资料
| 型号： | MCP1603-ADJI/MC |
| 厂商： | Microchip Technology |
| 文件页数： | 19/26页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 0.5A 8-DFN |
| 标准包装： | 150 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.8 V ~ 4.5 V |
| 输入电压： | 2.7 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 2MHz |
| 电流 - 输出： | 500mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-VFDFN 裸露焊盘 |
| 包装： | 管件 |
| 供应商设备封装： | 8-DFN（3x2） |
| 产品目录页面： | 669 (CN2011-ZH PDF) |
| 配用： | MCP1603RD-TNY-ND - REFERENCE DESIGN FOR MCP1603 MCP1603EV-ND - BOARD EVAL BUCK CONV MCP1603 |
MCP1603
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
D
E
L
K
EXPOSED PAD
b
e
N
E2
NOTE 1
1
2
2
1
NOTE 1
D2
TOP VIEW
A
BOTTOM VIEW
A 3
A1
NOTE 2
Units
MILLIMETERS
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
0.50 BSC
MAX
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
A
A1
A3
D
E
D2
E2
b
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
0.90
0.02
0.20 REF
2.00 BSC
3.00 BSC
–
–
0.25
0.40
–
1.00
0.05
1.75
1.90
0.30
0.50
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
? 2007 Microchip Technology Inc.
DS22042A-page 19
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