参数资料
型号: MCP1603-ADJI/MC
厂商: Microchip Technology
文件页数: 5/26页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 0.5A 8-DFN
标准包装: 150
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.8 V ~ 4.5 V
输入电压: 2.7 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 2MHz
电流 - 输出: 500mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘
包装: 管件
供应商设备封装: 8-DFN(3x2)
产品目录页面: 669 (CN2011-ZH PDF)
配用: MCP1603RD-TNY-ND - REFERENCE DESIGN FOR MCP1603
MCP1603EV-ND - BOARD EVAL BUCK CONV MCP1603
MCP1603
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, V IN = SHDN = 3.6V, C OUT = C IN = 4.7 μF, L = 4.7 μH, V OUT (ADJ) = 1.8V,
I OUT = 100 mA, T A = +25°C. Boldface specifications apply over the T A range of -40°C to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Output Characteristics
Adjustable Output Voltage Range
Reference Feedback Voltage
Reference Feedback Voltage
Tolerance
Feedback Input Bias Current
Output Voltage Tolerance Fixed
Line Regulation
Load Regulation
Internal Oscillator Frequency
Start Up Time
R DSon P-Channel
R DSon N-Channel
L X Pin Leakage Current
Positive Current Limit Threshold
V OUT
V FB
I VFB
V OUT
V OUT
V LINE-
REG
V LOAD-
REG
F OSC
T SS
R DSon-P
R DSon-N
I LX
+I LX(MAX)
0.8
-3.0
-2.5
-3.0%
-2.5
1.5
-1.0
0.8
0.1
V R
V R
0.3
0.35
2.0
0.6
500
500
±0.1
860
4.5
+3.0
+2.5
+3.0%
+2.5
2.8
1.0
V
V
%
%
nA
%
%
%/V
%
MHz
ms
m Ω
m Ω
μA
mA
T A = -40°C to +25°C
T A = +25°C to +85°C
T A = -40°C to +25°C, Note 3
T A = +25°C to +85°C, Note 3
V IN = V R + 1V to 5.5V,
I OUT = 100 mA
V IN = V R +1.5V,
I LOAD = 100 mA to 500 mA
T R = 10% to 90%
I P = 100 mA
I N = 100 mA
SHDN = 0V, V IN = 5.5V,
L X = 0V, L X = 5.5V
Note 1:
2:
3:
4:
5:
6:
The minimum V IN has to meet two conditions: V IN ≥ 2.7V and V IN ≥ V OUT + 0.5V.
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
V R is the output voltage setting.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. T A , T J , θ JA ). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
The internal MOSFET switches have an integral diode from the L X pin to the V IN pin, and from the L X pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
The current limit threshold is a cycle-by-cycle peak current limit.
? 2007 Microchip Technology Inc.
DS22042A-page 5
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