参数资料
型号: MCP1603EV
厂商: Microchip Technology
文件页数: 19/26页
文件大小: 0K
描述: BOARD EVAL BUCK CONV MCP1603
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 0.8V,1.2V,1.8V,2.5V,和 3.3V
电流 - 输出: 500mA
输入电压: 2.7 ~ 5.5 V
稳压器拓扑结构: 降压
频率 - 开关: 2MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: MCP1603
产品目录页面: 664 (CN2011-ZH PDF)
相关产品: MCP1603-ADJI/MC-ND - IC REG BUCK SYNC ADJ 0.5A 8-DFN
MCP1603T-250I/OSDKR-ND - IC REG BUCK SYNC 2.5V TSOT23-5
MCP1603T-120I/OSDKR-ND - IC REG BUCK SYNC 1.2V TSOT23-5
MCP1603T-250I/OSCT-ND - IC REG BUCK SYNC 2.5V TSOT23-5
MCP1603T-120I/OSCT-ND - IC REG BUCK SYNC 1.2V TSOT23-5
MCP1603-330I/MC-ND - IC REG BUCK SYNC 3.3V 0.5A 8DFN
MCP1603-250I/MC-ND - IC REG BUCK SYNC 2.5V 0.5A 8DFN
MCP1603-180I/MC-ND - IC REG BUCK SYNC 1.8V 0.5A 8DFN
MCP1603-150I/MC-ND - IC REG BUCK SYNC 1.5V 0.5A 8DFN
MCP1603-120I/MC-ND - IC REG BUCK SYNC 1.2V 0.5A 8DFN
更多...
MCP1603
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
D
E
L
K
EXPOSED PAD
b
e
N
E2
NOTE 1
1
2
2
1
NOTE 1
D2
TOP VIEW
A
BOTTOM VIEW
A 3
A1
NOTE 2
Units
MILLIMETERS
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
0.50 BSC
MAX
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
A
A1
A3
D
E
D2
E2
b
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
0.90
0.02
0.20 REF
2.00 BSC
3.00 BSC
0.25
0.40
1.00
0.05
1.75
1.90
0.30
0.50
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
? 2007 Microchip Technology Inc.
DS22042A-page 19
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