参数资料
型号: MCP1612EV
厂商: Microchip Technology
文件页数: 5/22页
文件大小: 0K
描述: BOARD EVAL FOR MCP1612
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 0.8V,1V,1.2V,1.4V,1.7V,2.4V 和 3.3V
电流 - 输出: 1A
输入电压: 2.7 ~ 5.5 V
稳压器拓扑结构: 降压
频率 - 开关: 1.4MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: MCP1612
产品目录页面: 669 (CN2011-ZH PDF)
MCP1612
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V IN = V CC = V SHDN = 3.3V, V OUT = 1.8V, C IN = C OUT = 10 μF, L = 3.3 μH,
I LOAD = 100 mA, T A = +25°C. Boldface specifications apply over the T A range of -40°C to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Protection Features
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Thermal Shutdown
Thermal Shutdown Hysteresis
UVLO
UVLO- HYS
T SHD
T SHD-HYS
2.4
2.55
200
160
9
2.7
V
mV
°C
°C
Interface Signal (SHDN)
Logic-High Input
Logic-Low Input
V IN-HIGH
V IN-LOW
45
15
% of V IN
% of V IN
Note 1:
2:
The integrated MOSFET switches have an integral diode from the L X pin to V IN and from L X to P GND . In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to regulate the junction temperature for these cases.
UVLO is specified for a falling V IN . Once the UVLO is activated, the UVLO- HYS must be overcome before the device will
return to operation.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: V IN = 3.0V to 5.5V, F OSC = 1 MHz with 10% Duty Cycle, C IN = 0.1 μF. T A = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Storage Temperature Range
Maximum Junction Temperature
Operating Junction Temperature Range
T A
T J
T A
-65
- 40
+150
+150
+ 125
°C
°C
°C
Continuous
Transient Only
Continuous Operation
Thermal Package Resistances
Thermal Resistance, 8L-MSOP
θ JA
208
°C/W
Typical 4-layer board interconnecting
vias
Thermal Resistance, 8L-DFN
θ JA
41
°C/W
Typical 4-layer board interconnecting
vias
? 2005 Microchip Technology Inc.
DS21921B-page 5
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