参数资料
型号: MCP1623T-I/MC
厂商: Microchip Technology
文件页数: 18/28页
文件大小: 0K
描述: IC BOOST SYNC REG PWM 8DFN
标准包装: 3,300
应用: 转换器,PIC? 微控制器
输入电压: 0.8 V ~ 5.5 V
输出数: 1
输出电压: 2 V ~ 5.5 V
工作温度: -45°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘
供应商设备封装: 8-DFN(2x3)
包装: 带卷 (TR)
MCP1623/24
6-Lead Plastic Small Outline Transistor (CHY) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
N
4
E1
E
PIN 1 ID BY
LASER MARK
1
2
3
e
e1
D
A
A2
c
φ
A1
Units
MILLIMETERS
L
L1
Number of Pins
Pitch
Outside Lead Pitch
Dimension Limits
N
e
e1
MIN
NOM
6
0.95 BSC
1.90 BSC
MAX
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
A
A2
A1
E
E1
D
L
L1
I
c
0.90
0.89
0.00
2.20
1.30
2.70
0.10
0.35
0.08
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
30°
0.26
Lead Width b 0.20 – 0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-028B
DS41420C-page 18
? 2011 Microchip Technology Inc.
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