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参数资料
| 型号： | MCP1630DM-DDBS1 |
| 厂商： | Microchip Technology |
| 文件页数： | 19/26页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO BOOST AUTO INPUT |
| 标准包装： | 1 |
| 主要目的： | DC/DC，步升 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 36.5V |
| 电流 - 输出： | 400mA |
| 输入电压： | 9 ~ 18 V |
| 稳压器拓扑结构： | 升压 |
| 频率 - 开关： | 500kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | MCP1630 |
| 产品目录页面： | 668 (CN2011-ZH PDF) |
| 相关产品： | MCP1630V-E/MC-ND - IC REG CTRLR BST FLYBK ISO 8-DFN MCP1630-E/MC-ND - IC REG CTRLR BST FLYBK ISO 8-DFN MCP1630VT-E/MC-ND - IC REG CTRLR BST FLYBK ISO 8-DFN MCP1630T-E/MC-ND - IC REG CTRLR BST FLYBK ISO 8-DFN MCP1630VT-E/MSCT-ND - IC REG CTRLR BST FLYBK ISO 8MSOP MCP1630VT-E/MSTR-ND - IC REG CTRLR BST FLYBK ISO 8MSOP MCP1630V-E/MS-ND - IC REG CTRLR BST FLYBK ISO 8MSOP MCP1630T-E/MS-ND - IC REG CTRLR BST FLYBK ISO 8MSOP MCP1630-E/MS-ND - IC REG CTRLR BST FLYBK ISO 8MSOP |
MCP1630/MCP1630V
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
For DFN samples, contact your Microchip Sales Office for availability..
p
D
b
n
L
E
EXPOSED
E2
PIN 1
ID INDEX
AREA
METAL
PAD
2
D2
1
(NOTE 2)
A3
TOP VIEW
A1
A
EXPOSED
TIE BAR
(NOTE 1)
BOTTOM VIEW
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
p
.020 BSC
8
0.50 BSC
8
Overall Height
Standoff
A
A1
.031
.000
.035
.001
.039
.002
0.80
0.00
0.90
0.02
1.00
0.05
Contact Thickness
Overall Length
A3
D
.008 REF.
.079 BSC
0.20 REF.
2.00 BSC
Exposed Pad Length
(Note 3)
D2
.055
.065
.067
1.39
1.65
1.70
Overall Width
E
.118 BSC
3.00 BSC
Exposed Pad Width
Contact Width
Contact Length
(Note 3)
E2
b
L
.047
.008
.012
.059
.010
.016
.061
.012
.020
1.20
0.20
0.30
1.50
0.25
0.40
1.55
0.30
0.50
*Controlling Parameter
Notes:
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Exposed pad varies according to die attach paddle size.
Package may have one or more exposed tie bars at ends.
Pin 1 visual index feature may vary, but must be located within the hatched area.
JEDEC equivalent: M0-229
Drawing No. C04-123, Revised 05-05-05
? 2005 Microchip Technology Inc.
DS21896B-page 19
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