参数资料
型号: MCP1631VHV-500E/ST
厂商: Microchip Technology
文件页数: 8/34页
文件大小: 0K
描述: IC REG CTRLR ISO PWM VM 20-TSSOP
标准包装: 74
PWM 型: 电压模式
输出数: 1
频率 - 最大: 2MHz
占空比: 10%
电源电压: 3.5 V ~ 16 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
包装: 管件
产品目录页面: 668 (CN2011-ZH PDF)
MCP1631/HV/MCP1631V/VHV
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V IN = 3.0V to 5.5V, F OSC = 1 MHz with 10% Duty Cycle, C IN = 0.1 μF,
V DD for typical values = 5.0V, T A for typical values = +25°C, T A = -40°C to +125°C for all minimum and maximums.
Parameters
Line Regulation
Load Regulation
Dropout Voltage
Output Delay Time
Sym
Δ V OUT /
(V OUT X Δ
V IN )
Δ V OUT /
V OUT
V DROPOUT
T DELAY
Min
-0.3
-2.5
Typ
±0.1
±1.0
330
525
1000
Max
+0.3
+2.5
650
725
Units
%/V
%
mV
mV
μs
Conditions
(V OUT(MAX) + V DROPOUT(MAX) ) ≤
V IN ≤ 16V Note 2
I L = 1.0 mA to 250 mA, Note 4
I L = 250 mA, V R = 5.0V
I L = 250 mA, V R = 3.3V
V IN = 0V to 6V, V OUT = 90% V R ,
R L = 50 ? resistive
Output Noise
e N
8
μV/ I L = 50 mA, f = 1 kHz, C OUT =
(Hz) 1/2 1 μF
Power Supply Ripple Rejection
Ratio
PSRR
44
dB
f = 100 Hz, C OUT = 1 μF,
I L = 100 μA,
V INAC =100 mV pk-pk,
C IN = 0 μF, V R = 1.2V
Protection Features
Thermal Shutdown
Thermal Shutdown Hysteresis
T SHD
T SHD_HYS
150
18
°C
°C
Note 1:
2:
3:
4:
5:
External Oscillator Input (OSC IN ) rise and fall times between 10 ns and 10 μs were determined during device
characterization testing. Signal levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90%
of maximum and minimum values. Not production tested. Additional timing specifications were fully characterized and
specified that are not production tested.
The minimum V IN must meet two conditions: V IN ≥ 3.5V and V IN ≥ (V OUT(MAX) + V DROPOUT(MAX) ).
TCV OUT = (V OUT-HIGH - V OUT-LOW ) *10 6 / (V R * Δ Temperature), V OUT-HIGH = highest voltage measured over the
temperature range. V OUT-LOW = lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV OUT .
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of V OUT(MAX) + V DROPOUT(MAX) or 3.5V, whichever is greater.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits are specified for: V IN + 3.0V to 5.5V
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Junction Temperature
Range
Storage Temperature Range
Maximum Junction Temperature
T J
T A
T J
-40
-65
+125
+150
+150
°C
°C
°C
Steady State
Transient
Package Thermal Resistances
Thermal Resistance, 20L-TSSOP
Thermal Resistance, 20L-SSOP
Thermal Resistance, 20L-QFN
θ JA
θ JA
θ JA
90
89.3
43
°C/W
°C/W
°C/W
Typical 4 Layer board with
interconnecting vias
Typical 4 Layer board with
interconnecting vias
Typical 4 Layer board with
interconnecting vias
DS22063B-page 8
? 2008 Microchip Technology Inc.
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